18420068. MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chih-Hung Huang of Hsinchu (TW)
Cheng-Lung Wu of Zhunan Township (TW)
Zheng-Lin He of Hsinchu City (TW)
Yang-Ann Chu of Hsinchu City (TW)
Jiun-Rong Pai of Jhubei City (TW)
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18420068 titled 'MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
Simplified Explanation
The die sorter tool described in the patent application is a machine that sorts and manipulates dies used in manufacturing processes. Here is a simplified explanation of the abstract:
- The die sorter tool includes a first conveyor and a first lane to receive carriers with sets of dies from load ports.
- A die flip module manipulates the orientation of the dies within the carrier without changing their positions.
- The carrier is then transferred to a second conveyor and lane before being returned to the load ports.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Automotive industry
Problems Solved: - Efficient sorting and manipulation of dies - Minimizing handling damage to delicate dies
Benefits: - Increased productivity - Improved quality control - Reduced labor costs
Potential Commercial Applications: - Die manufacturing companies - Semiconductor fabrication facilities - Electronics assembly plants
Possible Prior Art: - Automated die handling systems in semiconductor industry - Die flipping machines in electronics manufacturing
Unanswered Questions: 1. How does the die flip module ensure precise manipulation of the dies' orientations? 2. What safety features are in place to prevent damage to the dies during handling and manipulation?
Original Abstract Submitted
A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
