18418930. METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER simplified abstract (Applied Materials, Inc.)

From WikiPatents
Jump to navigation Jump to search

METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER

Organization Name

Applied Materials, Inc.

Inventor(s)

Alan Ritchie of Pleasanton CA (US)

John C. Forster of Mountain View CA (US)

Muhammad Rasheed of San Jose CA (US)

METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18418930 titled 'METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER

Simplified Explanation: The patent application describes methods and apparatus for physical vapor deposition, specifically focusing on a process kit shield with specific dimensions for use in a deposition chamber.

  • The process kit shield has an electrically conductive body with sidewalls that define a central opening.
  • The ratio of the surface area of the inner facing surfaces of the sidewalls to the height of the sidewalls is between 2 to 3.

Key Features and Innovation:

  • Electrically conductive body with specific dimensions for physical vapor deposition.
  • Central opening for targeted deposition processes.
  • Optimal ratio of surface area to height for efficient deposition.

Potential Applications:

  • Semiconductor manufacturing.
  • Thin film deposition.
  • Optical coatings.

Problems Solved:

  • Ensures uniform and precise deposition.
  • Reduces contamination in the deposition chamber.

Benefits:

  • Improved deposition accuracy.
  • Enhanced efficiency in thin film production.
  • Reduced maintenance and cleaning requirements.

Commercial Applications: The technology can be utilized in industries such as semiconductor manufacturing, optical coatings, and research institutions for thin film deposition processes.

Prior Art: Readers can explore prior patents related to physical vapor deposition methods and apparatus to understand the evolution of this technology.

Frequently Updated Research: Stay updated on advancements in physical vapor deposition techniques and equipment to enhance deposition processes and efficiency.

Questions about Physical Vapor Deposition: 1. What are the key differences between physical vapor deposition and chemical vapor deposition? 2. How does the ratio of surface area to height in a process kit shield impact the deposition process?


Original Abstract Submitted

Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.

Retrieved from "http://wikipatents.org/index.php?title=18418930._METHODS_AND_APPARATUS_FOR_REDUCING_SPUTTERING_OF_A_GROUNDED_SHIELD_IN_A_PROCESS_CHAMBER_simplified_abstract_(Applied_Materials,_Inc.)&oldid=71330"