18418513. RADIO FREQUENCY FRONT-END STRUCTURES simplified abstract (Intel Corporation)

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RADIO FREQUENCY FRONT-END STRUCTURES

Organization Name

Intel Corporation

Inventor(s)

Sidharth Dalmia of Portland OR (US)

Zhenguo Jiang of Chandler AZ (US)

William J. Lambert of Chandler AZ (US)

Kirthika Nahalingam of San Jose CA (US)

Swathi Vijayakumar of Folsom CA (US)

RADIO FREQUENCY FRONT-END STRUCTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18418513 titled 'RADIO FREQUENCY FRONT-END STRUCTURES

Simplified Explanation

The abstract describes an RF front-end package with an embedded passive circuit element in the RF package substrate.

  • The RF front-end package includes an RF package substrate with an embedded passive circuit element.
  • The embedded passive circuit element is at least partially included in a metal layer of the RF package substrate.
  • The RF package substrate also contains a ground plane in the metal layer.

Potential Applications

This technology could be applied in:

  • Wireless communication systems
  • Radar systems
  • Satellite communication systems

Problems Solved

This technology helps in:

  • Improving signal quality
  • Reducing interference
  • Enhancing overall performance of RF front-end structures

Benefits

The benefits of this technology include:

  • Enhanced reliability
  • Improved efficiency
  • Compact design

Potential Commercial Applications

Potential commercial applications of this technology could be in:

  • Mobile devices
  • IoT devices
  • Automotive electronics

Possible Prior Art

One possible prior art could be the use of embedded passive components in electronic packaging to improve performance and reduce size.

Unanswered Questions

How does this technology compare to traditional RF front-end structures?

This article does not provide a direct comparison between this technology and traditional RF front-end structures.

What specific materials are used in the embedded passive circuit element?

The article does not specify the exact materials used in the embedded passive circuit element.


Original Abstract Submitted

Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

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