18418434. HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
- 1 HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM
Organization Name
Inventor(s)
HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18418434 titled 'HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM
Simplified Explanation
The heat dissipation apparatus described in the patent application includes a heat-conducting plate with a liquid channel, a mounting base with an accommodation cavity, and a pressing plate to fasten the heat-conducting plate in the cavity. A sealing cavity is formed between the pressing plate and the heat-conducting plate to accommodate the liquid channel, with liquid inlet and outlet connectors on the pressing plate.
- Heat dissipation apparatus with liquid channel for cooling
- Mounting base with accommodation cavity for heat-conducting plate
- Pressing plate to fasten heat-conducting plate in cavity
- Sealing cavity to accommodate liquid channel
- Liquid inlet and outlet connectors on pressing plate
Potential Applications
The technology could be applied in various electronic devices such as computers, servers, and LED lighting systems to efficiently dissipate heat and improve overall performance.
Problems Solved
1. Efficient heat dissipation in electronic devices 2. Prevention of overheating and potential damage to components
Benefits
1. Improved performance and longevity of electronic devices 2. Enhanced thermal management capabilities 3. Increased reliability and stability of systems
Potential Commercial Applications
Optimizing heat dissipation in high-performance computing systems
Possible Prior Art
There are existing heat dissipation solutions in the market, such as heat sinks and fans, but the specific design of this apparatus with a liquid channel and sealing cavity may offer unique advantages in certain applications.
Unanswered Questions
1. What materials are used in the construction of the heat-conducting plate and mounting base? 2. How does the efficiency of heat dissipation compare to traditional cooling methods like heat sinks and fans?
Original Abstract Submitted
A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.
