18418318. METHOD FOR FABRICATING DEVICE DIE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 METHOD FOR FABRICATING DEVICE DIE
METHOD FOR FABRICATING DEVICE DIE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Tzuan-Horng Liu of Taoyuan City (TW)
Chia-Hung Liu of Hsinchu City (TW)
Hao-Yi Tsai of Hsinchu City (TW)
METHOD FOR FABRICATING DEVICE DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18418318 titled 'METHOD FOR FABRICATING DEVICE DIE
Simplified Explanation
The abstract describes a patent application for a device die that includes multiple semiconductor dies, an anti-arcing layer, and an insulating encapsulant. The second semiconductor die is stacked over and connected to the first semiconductor die, with the anti-arcing layer in contact with the second semiconductor die and the insulating encapsulant covering both dies.
- The device die includes a first semiconductor die and a second semiconductor die stacked and connected together.
- An anti-arcing layer is in contact with the second semiconductor die to prevent arcing.
- A first insulating encapsulant covers the first semiconductor die and encapsulates the second semiconductor die laterally.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This technology helps prevent arcing between semiconductor dies, improving the reliability and performance of electronic devices.
Benefits
The device die design enhances the electrical connection between semiconductor dies, reduces the risk of arcing, and provides better overall protection for the components.
Potential Commercial Applications
Potential commercial applications of this technology include the production of high-performance electronic devices for various industries, such as telecommunications, automotive, and consumer electronics.
Possible Prior Art
One possible prior art could be the use of insulating encapsulants in semiconductor packaging to protect the components and improve performance. However, the specific combination of a stacked semiconductor die, anti-arcing layer, and insulating encapsulant as described in this patent application may be a novel innovation.
Unanswered Questions
How does the anti-arcing layer prevent arcing between the semiconductor dies?
The anti-arcing layer is designed to provide a barrier between the semiconductor dies, preventing electrical discharge and arcing. This could be achieved through the use of specific materials with high dielectric strength or by creating a physical barrier that inhibits the flow of current between the dies.
What are the specific methods used to fabricate the device dies with the described features?
The patent application mentions methods for fabricating device dies, but the specific techniques and processes involved in creating the stacked semiconductor dies, anti-arcing layer, and insulating encapsulant are not detailed in the abstract. Further information on the fabrication process would be necessary to fully understand the implementation of this technology.
Original Abstract Submitted
A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.
