18416880. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Kazuya Nagaseki of Miyagi (JP)
Satoru Teruuchi of Miyagi (JP)
PROCESSING METHOD AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18416880 titled 'PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
Simplified Explanation: The patent application describes a method and device for plasma processing on a substrate using a temperature adjustment target with a deformable heat transfer layer.
- The method involves placing a temperature adjustment target on a support surface in a decompressible processing chamber.
- A heat transfer layer is formed on the support surface of the substrate support.
- Plasma processing is then performed on the substrate with the heat transfer layer.
- The heat transfer layer is deformable and can include a liquid layer or a deformable solid layer.
Key Features and Innovation:
- Use of a temperature adjustment target with a deformable heat transfer layer.
- Ability to perform plasma processing on a substrate with improved heat transfer capabilities.
- Deformable heat transfer layer can adapt to the substrate surface for efficient processing.
Potential Applications: The technology can be used in various industries such as semiconductor manufacturing, solar panel production, and display panel fabrication.
Problems Solved: The technology addresses the need for improved heat transfer during plasma processing, leading to better substrate processing efficiency and quality.
Benefits:
- Enhanced heat transfer capabilities during plasma processing.
- Improved substrate processing efficiency and quality.
- Versatile applications across different industries.
Commercial Applications: Title: Advanced Plasma Processing Technology for Enhanced Substrate Treatment This technology can be utilized in semiconductor manufacturing, solar panel production, and display panel fabrication industries, leading to improved processing efficiency and product quality.
Prior Art: Readers can explore prior research on plasma processing methods, heat transfer technologies, and substrate treatment techniques to understand the evolution of this innovation.
Frequently Updated Research: Researchers are continually exploring new materials for deformable heat transfer layers and optimizing plasma processing parameters for enhanced substrate treatment.
Questions about Plasma Processing Technology: 1. How does the deformable heat transfer layer improve substrate processing efficiency? 2. What are the potential challenges in implementing this technology in industrial-scale plasma processing systems?
Original Abstract Submitted
A processing method and corresponding device for performing plasma processing on a substrate includes placing a temperature adjustment target onto a support surface of a substrate support in a processing chamber being decompressible, forming a heat transfer layer for the temperature adjustment target on the support surface of the substrate support, and performing plasma processing on the substrate on the support surface on which the heat transfer layer is formed. The heat transfer layer is deformable and includes at least one of a liquid layer or a deformable solid layer.
