18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sehoon Jang of Suwon-si (KR)

Inhwa Baek of Suwon-si (KR)

Hyungku Kim of Suwon-si (KR)

Kibum Yu of Suwon-si (KR)

Jaesung Yun of Suwon-si (KR)

Yongin Lee of Suwon-si (KR)

Jaehyuk Jung of Suwon-si (KR)

Gwanghee Jo of Suwon-si (KR)

Youngjin Cho of Suwon-si (KR)

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18415798 titled 'SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

The abstract describes a substrate bonding apparatus with a first bonding chuck and a second base facing it. The first base has a recess groove, while the first transformation plate has a protrusion and can support a substrate.

• First bonding chuck with a first base and a first transformation plate
• Second base facing the first bonding chuck
• Recess groove on the first base
• Protrusion on the first transformation plate
• Ability to vary distance between the first transformation plate and the first base

Potential Applications: - Semiconductor manufacturing - Microelectronics assembly - Optoelectronics production

Problems Solved: - Precise substrate bonding - Maintaining consistent distance between components

Benefits: - Improved bonding accuracy - Enhanced production efficiency - Reduced material waste

Commercial Applications: Title: Advanced Substrate Bonding Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to streamline the bonding process, leading to higher yields and lower production costs.

Questions about Substrate Bonding Apparatus: 1. How does the apparatus ensure precise bonding between substrates? The apparatus utilizes a combination of the recess groove and protrusion to maintain a consistent distance between the components, ensuring accurate bonding.

2. What are the potential drawbacks of using this substrate bonding apparatus? While the apparatus offers improved accuracy and efficiency, it may require specialized training for operators to maximize its benefits.

Original Abstract Submitted

A substrate bonding apparatus may include a first bonding chuck including a first base and a first transformation plate, and a second including a second base facing the first bonding chuck. The first base may include a recess groove. The recess groove may be recessed inward from a surface on which the first transformation plate is mounted. The first transformation plate may include a first protrusion protruding outward from a first surface of the first transformation plate. A second surface of the first transformation plate may be opposite the first surface of the first transformation plate. The second surface of the first transformation plate may be configured to support a first substrate. The first transformation plate may be mounted on the first base in a manner allowing a distance between the first transformation plate and the first base to vary.