18415086. RESISTOR WITHIN A VIA simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

RESISTOR WITHIN A VIA

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chi-Han Yang of Hsinchu (TW)

RESISTOR WITHIN A VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 18415086 titled 'RESISTOR WITHIN A VIA

Simplified Explanation

The abstract describes a patent application related to semiconductor processing tools forming a via for a semiconductor device, depositing various layers and components within the via.

• Semiconductor processing tools create a via for a semiconductor device.
• Metal plug is deposited within the via.
• Oxide-based layer is deposited on the metal plug.
• Resistor is deposited on the oxide-based layer.
• First and second landing pads are deposited on the resistor.
• First metal plug is deposited on the first landing pad, and second metal plug on the second landing pad.

Potential Applications

This technology could be applied in the manufacturing of advanced semiconductor devices, such as integrated circuits and microprocessors.

Problems Solved

This technology helps in creating complex semiconductor structures with precise layer deposition, enabling improved performance and functionality of semiconductor devices.

Benefits

The benefits of this technology include enhanced conductivity, improved signal transmission, and increased efficiency of semiconductor devices.

Potential Commercial Applications

The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing, and research institutions.

Possible Prior Art

Prior art in semiconductor processing tools and techniques for creating vias and depositing layers within them may exist, but specific examples are not provided in this context.

How does this technology compare to existing methods of semiconductor device manufacturing?

This article does not provide a direct comparison between this technology and existing methods in semiconductor device manufacturing.

What are the specific materials and processes used in depositing the various layers within the via?

The article does not detail the specific materials and processes used in depositing the metal plug, oxide-based layer, resistor, landing pads, and metal plugs within the via.

Original Abstract Submitted

In some implementations, one or more semiconductor processing tools may form a via for a semiconductor device. The one or more semiconductor processing tools may deposit a metal plug within the via. The one or more semiconductor processing tools may deposit an oxide-based layer on the metal plug within the via. The one or more semiconductor processing tools may deposit a resistor on the oxide-based layer within the via. The one or more semiconductor processing tools may deposit a first landing pad and a second landing pad on the resistor within the via. The one or more semiconductor processing tools may deposit a first metal plug on the first landing pad and a second metal plug on the second landing pad.