18414292. BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE simplified abstract (NVIDIA Corporation)
Contents
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
Malcolm Gutenburg of San Francisco CA (US)
David Haley of Beaverton OR (US)
Yunseok Kim of Pleasanton CA (US)
Amit Kulkarni of San Jose CA (US)
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18414292 titled 'BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE
The abstract describes an electronic device with a printed circuit board, an integrated circuit connected to the board with a thermal solution on one side, a thermal interface material between the integrated circuit and the thermal solution, and an electrically insulative barrier seal around the integrated circuit.
- The electronic device includes a printed circuit board.
- An integrated circuit is connected to the printed circuit board on one side.
- A thermal solution is present on the other side of the integrated circuit.
- A thermal interface material is placed between the integrated circuit and the thermal solution.
- A barrier seal surrounds the integrated circuit and is electrically insulative.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, laptops, and tablets. - It can also be applied in industrial equipment and automotive systems where thermal management is crucial.
Problems Solved: - Provides efficient thermal management for electronic devices. - Ensures the integrated circuit remains cool during operation, enhancing performance and longevity.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced thermal dissipation capabilities. - Increased lifespan of integrated circuits.
Commercial Applications: Title: "Enhanced Thermal Management Solutions for Electronic Devices" This technology can be utilized in the consumer electronics industry, automotive sector, and industrial applications to improve thermal management and overall device performance.
Questions about Enhanced Thermal Management Solutions for Electronic Devices: 1. How does this technology compare to traditional thermal management solutions? - This technology offers improved thermal dissipation and performance compared to traditional methods. 2. What are the potential cost savings associated with implementing this thermal management solution? - Implementing this technology can lead to cost savings by reducing the need for additional cooling components and improving the overall efficiency of electronic devices.
Original Abstract Submitted
An electronic device comprises: a printed circuit board; an integrated circuit that is coupled to the printed circuit board on a first side and a thermal solution on a second side; a thermal interface material that is disposed between the integrated circuit and the thermal solution; and a first barrier seal that is disposed around a perimeter of the integrated circuit and is electrically insulative.
