18413910. METROLOGY METHOD AND APPARATUS simplified abstract (ASML NETHERLANDS B.V.)
Contents
METROLOGY METHOD AND APPARATUS
Organization Name
Inventor(s)
Arjan Johannes Anton Beukman of Son en Breugel (NL)
Omar El Gawhary of Veldhoven (NL)
Ilse Van Weperen of Veldhoven (NL)
[[:Category:Pieter Joseph Marie W�ltgens of Veldhoven (NL)|Pieter Joseph Marie W�ltgens of Veldhoven (NL)]][[Category:Pieter Joseph Marie W�ltgens of Veldhoven (NL)]]
METROLOGY METHOD AND APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18413910 titled 'METROLOGY METHOD AND APPARATUS
The method described in the patent application involves measuring alignment on an alignment mark using illumination and capturing scattered radiation to determine the position of the mark.
- Illuminating the alignment mark with specific wavelengths
- Capturing scattered radiation from the mark
- Determining position values from the scattered radiation
- Alignment mark or feature is smaller than the wavelength in at least one dimension
Potential Applications: - Semiconductor manufacturing - Microelectronics - Nanotechnology
Problems Solved: - Accurate alignment measurement - Precision in manufacturing processes
Benefits: - Improved quality control - Enhanced production efficiency - Cost savings in manufacturing
Commercial Applications: Title: Advanced Alignment Measurement Technology for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to ensure precise alignment of components, leading to higher quality products and increased productivity in the manufacturing process.
Prior Art: Researchers in the field of semiconductor manufacturing and metrology may find relevant prior art in studies related to alignment measurement techniques and equipment.
Frequently Updated Research: Researchers in the field of nanotechnology and microelectronics are constantly exploring new methods for improving alignment measurement accuracy and efficiency.
Questions about Alignment Measurement Technology: 1. How does this technology improve alignment accuracy in semiconductor manufacturing? 2. What are the potential cost savings associated with implementing this alignment measurement method?
Original Abstract Submitted
Disclosed is a method for measuring alignment on an alignment mark, and associated apparatuses. The method comprises illuminating the alignment mark with illumination comprising at least one wavelength; capturing the scattered radiation scattered from the alignment mark as a result of said illumination step, and determining at least one position value for said alignment mark from an angularly resolved representation of said scattered radiation, wherein said alignment mark, or a feature thereof, is smaller than said at least one wavelength in at least one dimension of a substrate plane.
