18413491. SUBSTRATE PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Hyeon Dong Song of Suwon-si (KR)
Jun Young Moon of Suwon-si (KR)
Sang Woo Park of Suwon-si (KR)
Hyun Soo Chun of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18413491 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with robot arms and an alignment jig for wafer handling and positioning.
- The substrate processing apparatus includes a body with robot arms on the upper face, spaced apart in different directions, and capable of gripping wafers.
- An alignment jig is installed on the body to sense the positions of the robot arms, consisting of a horizontal frame on the upper face and a vertical frame on the side faces.
- The alignment jig includes a displacement sensor with two sensors to detect the coordinates of the robot arms in multiple directions.
- The upper face of the displacement sensor is positioned higher than the robot arms for accurate sensing.
Potential Applications: - Semiconductor manufacturing - Wafer processing facilities - Automated assembly lines
Problems Solved: - Precise wafer handling and positioning - Efficient substrate processing - Enhanced automation in manufacturing processes
Benefits: - Improved accuracy in wafer alignment - Increased productivity in substrate processing - Reduced manual labor in manufacturing operations
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can revolutionize the semiconductor industry by streamlining wafer handling and processing, leading to faster production cycles and higher yields.
Questions about the technology: 1. How does the alignment jig improve the efficiency of wafer handling? 2. What are the advantages of having multiple robot arms in the substrate processing apparatus?
Original Abstract Submitted
A substrate processing apparatus includes a body which includes an upper face and side faces, and extends in a first direction, a plurality of robot arms which are installed on the upper face of the body, extend in the first direction, are spaced apart from each other in a second direction perpendicular to the upper face of the body, and are able to grip a wafer, and an alignment jig (JIG) which is installed on the upper face and side faces of the body, and senses positions of the plurality of robot arms, wherein the alignment jig includes, a horizontal frame disposed on the upper face of the body, a vertical frame disposed on the side faces of the body, and a displacement sensor installed on the horizontal frame and the vertical frame to sense coordinates of upper faces of the plurality of robot arms and side faces of the plurality of robot arms, the displacement sensor includes a first sensor and a second sensor which are spaced apart from side faces of the plurality of robot arms in a third direction perpendicular to the first and second directions and spaced apart from each other in the first direction, and an upper face of the displacement sensor is disposed at a vertical level higher than vertical levels of the upper faces of each of the plurality of robot arms.
