18413184. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEOKBEOM Yong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18413184 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate, an upper chip, a passive element chip, and a lower chip. The passive element chip is positioned between the upper chip and the package substrate, with a through electrode connecting it to the lower chip. The passive element chip contains multiple passive elements on the through electrode, and its upper surface is in contact with the lower surface of the upper chip.
- The semiconductor package includes a package substrate, upper chip, passive element chip, and lower chip.
- The passive element chip features a through electrode that connects it to the lower chip.
- Multiple passive elements are present on the through electrode of the passive element chip.
- The upper surface of the passive element chip is in contact with the lower surface of the upper chip.
Potential Applications: - This semiconductor package design could be used in various electronic devices such as smartphones, tablets, and computers. - It may find applications in the automotive industry for use in vehicle electronics. - Industrial automation systems could benefit from the integration of this technology.
Problems Solved: - Improved connectivity and performance in semiconductor packages. - Enhanced reliability and durability of electronic devices. - Efficient heat dissipation in compact electronic systems.
Benefits: - Enhanced overall performance of electronic devices. - Increased reliability and longevity of semiconductor packages. - Improved thermal management for better efficiency.
Commercial Applications: Title: Semiconductor Package Technology for Enhanced Performance in Electronic Devices This technology could be utilized in the consumer electronics market, automotive industry, and industrial automation sector to enhance the performance and reliability of electronic devices.
Questions about Semiconductor Package Technology: 1. How does the through electrode in the passive element chip contribute to the overall functionality of the semiconductor package? 2. What are the potential advantages of having multiple passive elements on the through electrode in the passive element chip?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
A semiconductor package including a package substrate; an upper chip on the package substrate; a passive element chip between the upper chip and the package substrate; and a lower chip between the passive element chip and the package substrate, wherein the passive element chip includes a through electrode connected to the lower chip; and a plurality of passive elements on the through electrode, and the upper surface of the passive element chip is in contact with the lower surface of the upper chip.
