18410769. SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME simplified abstract (Micron Technology, Inc.)
Contents
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Bong Woo Choi of Singapore (SG)
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18410769 titled 'SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
Simplified Explanation: This patent application relates to a device with a mechanism to reduce delamination between a solder resist layer and a contact pad on a substrate. The mechanism has bonding strengths higher than direct contact between the solder resist layer and the contact pad.
- The device includes a delamination reduction mechanism between the solder resist layer and the contact pad.
- A solder opening is present in the solder resist layer over the contact pad.
- The mechanism has superior bonding strengths compared to direct contact between the solder resist layer and the contact pad.
Potential Applications: This technology can be applied in electronic manufacturing processes where delamination between layers is a concern. It can improve the reliability and durability of electronic devices.
Problems Solved: This technology addresses the issue of delamination between the solder resist layer and the contact pad, which can lead to device failure and reduced performance.
Benefits: The device with the delamination reduction mechanism offers enhanced reliability, durability, and performance. It can lead to longer-lasting electronic devices with improved quality.
Commercial Applications: The technology can be utilized in the production of various electronic devices such as smartphones, tablets, laptops, and other consumer electronics. Manufacturers can benefit from increased product reliability and customer satisfaction.
Prior Art: Readers can explore prior research on materials science, electronic packaging, and soldering techniques to understand the background of this technology.
Frequently Updated Research: Stay updated on advancements in materials engineering, microelectronics, and reliability testing to enhance the performance of devices with delamination reduction mechanisms.
Questions about Delamination Reduction Mechanism: 1. What are the key factors influencing the bonding strengths of the delamination reduction mechanism? 2. How does the presence of a solder opening impact the effectiveness of the mechanism?
Original Abstract Submitted
Methods, apparatuses, and systems related to a device having a delamination reduction mechanism disposed between a solder resist layer and a contact pad of a substrate. The substrate may include a solder opening in the solder resist layer over the contact pad. The delamination reduction mechanism may have bonding strengths relative to the solder resist layer and the contact pad that are greater than a bonding strength associated with a direct contact between the solder resist layer and the contact pad.
