18410644. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18410644 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The semiconductor package described in the abstract includes a first semiconductor chip, at least one second semiconductor chip on top of the first chip, a molding layer on the second chip, and a marking layer on one side of the molding layer, with the marking layer containing a hydrophobic material.
- The package features a unique design with multiple semiconductor chips stacked on top of each other.
- The marking layer, made of a hydrophobic material, is applied to one side of the molding layer.
- The inner sidewalls of the marking layer come into contact with the lower portion of the sidewalls of the molding layer.
Potential Applications: - This semiconductor package design could be used in various electronic devices such as smartphones, tablets, and laptops. - It may find applications in the automotive industry for advanced driver assistance systems (ADAS) and infotainment systems.
Problems Solved: - The design allows for compact packaging of multiple semiconductor chips in a single package. - The hydrophobic marking layer provides protection against moisture and environmental factors.
Benefits: - Improved efficiency in stacking multiple semiconductor chips in a single package. - Enhanced protection against moisture and environmental damage.
Commercial Applications: Title: Advanced Semiconductor Package Design for Electronics Industry This technology could be commercially used in the production of smartphones, tablets, laptops, and automotive electronics, leading to more compact and efficient devices with improved durability.
Questions about Semiconductor Package Design: 1. How does the hydrophobic marking layer protect the semiconductor chips from moisture?
The hydrophobic material in the marking layer repels water and prevents it from reaching the semiconductor chips, thus protecting them from moisture damage.
2. What are the advantages of stacking multiple semiconductor chips in a single package?
Stacking multiple chips allows for increased functionality and performance in electronic devices without significantly increasing their size.
Original Abstract Submitted
Provided is a semiconductor package including a first semiconductor chip, at least one second semiconductor chip on a top surface of the first semiconductor chip, a molding layer on the at least one second semiconductor chip, and a marking layer on at least one side of the molding layer, the marking layer including a hydrophobic material, wherein inner sidewalls of the marking layer contact a lower portion of sidewalls of the molding layer.
