18409728. ELECTRONIC DEVICE simplified abstract (Innolux Corporation)
Contents
ELECTRONIC DEVICE
Organization Name
Inventor(s)
Chia-Hao Tsai of Miaoli County (TW)
Ming-Jou Tai of Miaoli County (TW)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18409728 titled 'ELECTRONIC DEVICE
The abstract describes an electronic device with multiple layers and a data line for electrical connection.
- The device includes a substrate, a first insulating layer, a semiconductor layer, a second insulating layer, and a data line.
- The first insulating layer is on the substrate, the semiconductor layer is on the first insulating layer, and the second insulating layer has a hole.
- The data line is on the substrate and connected to the semiconductor layer through the hole.
- The first insulating layer has a recess corresponding to an edge of the semiconductor layer.
Potential Applications: - This technology can be used in the manufacturing of electronic devices such as displays, sensors, and integrated circuits. - It can also be applied in the development of advanced computing systems and communication devices.
Problems Solved: - Provides a method for efficient electrical connection between layers in electronic devices. - Helps in improving the performance and reliability of semiconductor components.
Benefits: - Enhances the overall functionality and durability of electronic devices. - Facilitates the miniaturization of components, leading to more compact and efficient devices.
Commercial Applications: - This technology can be utilized in the production of smartphones, tablets, laptops, and other consumer electronics. - It can also find applications in the automotive industry for advanced driver assistance systems and in medical devices for diagnostic equipment.
Questions about the technology: 1. How does the recess in the first insulating layer improve the performance of the semiconductor layer? 2. What are the specific advantages of using a data line for electrical connection in this electronic device?
Original Abstract Submitted
An electronic device including a substrate, a first insulating layer, a semiconductor layer, a second insulating layer and a data line is provided. The first insulation layer is disposed on the substrate. The semiconductor layer is disposed on the first insulating layer. The second insulating layer is disposed on the semiconductor layer and has a first hole. The data line is disposed on the substrate, and the data line is electrically connected to the semiconductor layer through the first hole. Corresponding to an edge of the semiconductor layer, the first insulating layer has a recess.
