18409369. METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)

METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Youngtek Oh of Suwon-si (KR)

Joonyong Park of Suwon-si (KR)

Kyungwook Hwang of Suwon-si (KR)

Dongkyun Kim of Suwon-si (KR)

Dongho Kim of Suwon-si (KR)

Sanghoon Song of Suwon-si (KR)

Minchul Yu of Suwon-si (KR)

Junsik Hwang of sUWON-SI (KR)

METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18409369 titled 'METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE

The abstract describes a method of transferring micro semiconductor chips using a transferring structure.

• The method involves aligning base transferring substrates on first and second substrates.
• Micro semiconductor chips are transferred to the base transferring substrates of the first and second substrates.
• This process creates a target transferring structure and a preliminary transferring structure.

Potential Applications:

• This technology can be used in the semiconductor industry for efficient chip transfer processes.
• It can streamline production processes in electronics manufacturing.

Problems Solved:

• This method addresses the need for precise and reliable transfer of micro semiconductor chips.
• It helps in reducing errors and improving the overall efficiency of chip transfer processes.

Benefits:

• Improved accuracy and precision in transferring micro semiconductor chips.
• Enhanced efficiency and productivity in semiconductor manufacturing processes.

Commercial Applications:

• This technology can be valuable in semiconductor manufacturing companies looking to optimize their production processes.
• It can also be beneficial for companies involved in electronics manufacturing.

Questions about the Technology: 1. How does this method improve the efficiency of transferring micro semiconductor chips? 2. What are the potential cost savings associated with implementing this technology?

Frequently Updated Research: There may be ongoing research in the semiconductor industry related to improving chip transfer processes using innovative methods and structures. Researchers and companies in this field may be exploring ways to enhance the speed and accuracy of chip transfers for increased productivity.

Original Abstract Submitted

A method of transferring a micro semiconductor chip and a transferring structure are provided. The method includes providing a plurality of base transferring substrates each including a plurality of grooves, aligning the plurality of base transferring substrates on a first substrate, aligning the plurality of base transferring substrates on a second substrate, providing a target transferring structure by transferring micro semiconductor chips to the base transferring substrates of the first substrate, and providing a preliminary transferring structure by transferring micro semiconductor chips to the base transferring substrates of the second substrate.