18407631. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Sangjine Park of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18407631 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The substrate processing apparatus described in the abstract includes an index module with a load port, first and second transfer modules for loading and unloading the substrate, and a processing module with multiple process chambers, one of which is a light processing chamber for irradiating light to a photoresist pattern on the substrate. The first transfer module moves the substrate between the index module and the processing module, while the second transfer module moves the substrate between the process chambers in the processing module. The first transfer module has a first hand unit and a second hand unit, and the second transfer module has a third hand unit and a fourth hand unit.
- Index module with load port
- First and second transfer modules for substrate loading and unloading
- Processing module with multiple process chambers, including a light processing chamber
- First transfer module moves substrate between index module and processing module
- Second transfer module moves substrate between process chambers in processing module
- First transfer module includes first and second hand units
- Second transfer module includes third and fourth hand units
Potential Applications: - Semiconductor manufacturing - Photolithography processes - Thin film deposition - MEMS fabrication - LED production
Problems Solved: - Efficient substrate handling - Precise substrate positioning - Enhanced process control - Reduced contamination risks - Improved productivity
Benefits: - Increased throughput - Enhanced process accuracy - Minimized downtime - Consistent process results - Cost-effective operation
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be utilized in semiconductor fabrication facilities to streamline substrate processing, improve yield rates, and reduce production costs. It has significant implications for the semiconductor industry, enabling manufacturers to achieve higher levels of efficiency and quality in their production processes.
Prior Art: Researchers can explore prior art related to substrate processing systems, semiconductor manufacturing equipment, and automation technologies in the field of microelectronics to gain insights into the evolution of similar technologies and innovations.
Frequently Updated Research: Researchers and industry professionals can stay informed about the latest advancements in substrate processing equipment, semiconductor manufacturing techniques, and automation solutions through industry conferences, academic journals, and technology forums.
Questions about Substrate Processing Apparatus: 1. How does the light processing chamber in the processing module contribute to the overall efficiency of the substrate processing? 2. What are the key advantages of having multiple hand units in the transfer modules for substrate handling?
Original Abstract Submitted
Provided is a substrate processing apparatus including an index module including a load port in which a substrate is accommodated, a first transfer module and a second transfer module for loading and unloading the substrate, and a processing module that is connected to the index module and includes a plurality of process chambers that process the substrate, wherein one of the plurality of process chambers includes a light processing chamber configured to irradiate light to a photoresist pattern of the substrate, the first transfer module transfers the substrate between the index module and the processing module, the second transfer module transfers the substrate between the plurality of process chambers in the processing module, the first transfer module includes a first hand unit and a second hand unit, and the second transfer module includes a third hand unit and a fourth hand unit.
