18407011. METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT simplified abstract (NICHIA CORPORATION)
Contents
- 1 METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT
Organization Name
Inventor(s)
Kazuki Yamaguchi of Tokushima-shi (JP)
Yoshitaka Sumitomo of Tokushima-shi (JP)
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18407011 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT
Simplified Explanation
The semiconductor element described in the abstract consists of a substrate with multiple surfaces and a semiconductor layer on one of the surfaces. The lateral surface of the substrate includes flat regions, first regions with higher surface roughness, and second regions with even higher surface roughness.
- The semiconductor element includes a substrate with multiple surfaces and a semiconductor layer on one surface.
- The lateral surface of the substrate has flat regions, first regions with higher surface roughness, and second regions with even higher surface roughness.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Electronic devices
Problems Solved
This technology helps in:
- Improving the performance of semiconductor elements
- Enhancing the quality of electronic devices
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor manufacturing
- Better overall performance of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be seen in:
- Semiconductor industry advancements
- Consumer electronics market growth
Possible Prior Art
One possible prior art could be:
- Research on surface roughness optimization in semiconductor manufacturing
Unanswered Questions
How does this technology compare to existing semiconductor manufacturing processes?
This article does not provide a direct comparison to existing semiconductor manufacturing processes, leaving room for further investigation into the specific advantages of this new technology.
What specific electronic devices could benefit the most from this technology?
The article does not specify the types of electronic devices that could benefit the most from this technology, prompting further research into potential target markets and applications.
Original Abstract Submitted
A semiconductor element includes: a substrate having a first surface, a second surface, and at least one lateral surface; and a semiconductor layer formed on the second surface. The at least one lateral surface includes: at least one flat region, a first region that extends along a first direction parallel to the first surface at a position apart from the first surface and the second surface, wherein a surface roughness of the first region is larger than a surface roughness of the flat region, and a second region that extends along the first direction parallel to the first surface at a position between the first region and the first surface and apart from the first surface, wherein a surface roughness of the second region is larger than the surface roughness of the flat region. The substrate includes, in an interior of the substrate, a plurality of modified portions.
