18406068. HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
Contents
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Organization Name
Inventor(s)
Bharat Bhushan of Taichung (TW)
Chaiyanan Kulchaisit of Hiroshima (JP)
Kyle K. Kirby of Eagle ID (US)
Akshay N. Singh of Boise ID (US)
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18406068 titled 'HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
The semiconductor device assembly described in the abstract consists of a semiconductor die with bond pads and a dielectric layer, and an interface die with bond pads, dielectric layers, a mechanically altered surface, and a redistribution layer.
- The semiconductor die has a frontside surface with bond pads and a dielectric layer.
- The interface die has a frontside surface, a backside surface, bond pads, dielectric layers, a mechanically altered surface, and a redistribution layer.
- Hybrid bonds are used between the semiconductor die and the interface die.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the performance and reliability of integrated circuits. - The hybrid bonding technique can be applied in various electronic applications requiring high-density interconnections.
Problems Solved: - Enhances the bond strength and electrical performance of semiconductor devices. - Facilitates the integration of multiple dies in a compact package. - Improves thermal dissipation and signal integrity in electronic systems.
Benefits: - Increased efficiency and functionality of semiconductor devices. - Enhanced reliability and durability of integrated circuits. - Enables the development of more compact and powerful electronic devices.
Commercial Applications: Title: Advanced Semiconductor Device Assembly for Enhanced Performance This technology can be utilized in the production of high-performance computing systems, telecommunications equipment, and consumer electronics. It has the potential to revolutionize the semiconductor industry by enabling the creation of more advanced and efficient electronic devices.
Questions about Semiconductor Device Assembly: 1. How does the hybrid bonding technique improve the performance of semiconductor devices? 2. What are the key advantages of using mechanically altered surfaces in the interface die?
Frequently Updated Research: Researchers are continually exploring new materials and processes to further enhance the performance and reliability of semiconductor devices. Stay updated on the latest advancements in hybrid bonding technology to leverage its full potential in electronic applications.
Original Abstract Submitted
A semiconductor device assembly, including a semiconductor die having a frontside surface, a first plurality of bond pads at the frontside surface and a first dielectric layer at the frontside surface; and an interface die having a frontside surface and a backside surface, the interface die including a second plurality of bond pads and a second dielectric layer disposed on the backside surface of the interface die, a third dielectric layer disposed on the frontside surface of the interface die, wherein the third dielectric layer includes a mechanically altered surface opposite the frontside surface of the interface die, and a redistribution layer disposed on the third dielectric layer and above the frontside surface of the interface die, wherein hybrid bonds are disposed between the frontside surface of the semiconductor die and the backside surface of the interface die.
