18405736. SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
Organization Name
Inventor(s)
Shaofeng Ding of Suwon-si (KR)
Jeong Hoon Ahn of Seongnam-si (KR)
SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18405736 titled 'SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
Simplified Explanation
The semiconductor device described in the abstract includes a substrate with a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer with a connection pattern connected to the dummy transistor, a first metal layer, and an etch stop layer between the intermediate connection layer and the first metal layer. Additionally, there is a penetration contact extending from the first metal layer towards the bottom surface of the substrate, penetrating the connection region.
- Logic cell region and connection region on the substrate
- Dummy transistor and intermediate connection layer with connection pattern
- First metal layer and etch stop layer
- Penetration contact extending towards the bottom surface of the substrate
Potential Applications
The technology described in this patent application could be applied in the manufacturing of advanced semiconductor devices for various electronic applications, such as mobile devices, computers, and automotive electronics.
Problems Solved
This technology helps in improving the performance and reliability of semiconductor devices by providing a more efficient and reliable connection between components on the substrate.
Benefits
The benefits of this technology include enhanced electrical connectivity, improved signal transmission, and overall better functionality of semiconductor devices.
Potential Commercial Applications
The technology could be commercially applied in the semiconductor industry for the production of high-performance integrated circuits and electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of etch stop layers in semiconductor devices to control the etching process and protect certain layers during fabrication.
Unanswered Questions
How does this technology impact the overall cost of manufacturing semiconductor devices?
The abstract does not provide information on the cost implications of implementing this technology in semiconductor device manufacturing processes.
What specific electronic applications could benefit the most from this technology?
The abstract does not specify the potential electronic applications that could benefit the most from the innovations described in the patent application.
Original Abstract Submitted
A semiconductor device includes a substrate including a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer on the dummy transistor, the intermediate connection layer including a connection pattern electrically connected to the dummy transistor, a first metal layer on the intermediate connection layer, an etch stop layer between the intermediate connection layer and the first metal layer, the etch stop layer covering a top surface of the connection pattern, and a penetration contact extended from the first metal layer toward a bottom surface of the substrate penetrating the connection region.
