18405268. ELECTRONIC DEVICE COMPRISING CAMERA MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
ELECTRONIC DEVICE COMPRISING CAMERA MODULE
Organization Name
Inventor(s)
ELECTRONIC DEVICE COMPRISING CAMERA MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18405268 titled 'ELECTRONIC DEVICE COMPRISING CAMERA MODULE
The camera module described in the patent application includes a rigid printed circuit board (RPCB), a metal plate with holes, a multi-layer ceramic condenser (MLCC), and an image sensor.
- The MLCC is placed in the holes of the RPCB, with a height lower than that of the metal plate.
- In another embodiment, a flexible printed circuit board (FPCB) is used, along with the RPCB, metal plate, MLCC, and image sensor.
- The MLCC is positioned below the FPCB, in spaces created by holes in the RPCB and metal plate.
- This design eliminates the need for a separate space to mount a ceramic capacitor, improving space utilization.
Potential Applications: - Mobile phones - Digital cameras - Surveillance systems - Automotive cameras
Problems Solved: - Efficient use of space in camera modules - Simplified assembly process - Enhanced performance due to optimized component placement
Benefits: - Compact camera module design - Improved space utilization - Enhanced functionality and performance
Commercial Applications: The technology can be applied in various industries such as mobile phone manufacturing, surveillance systems, automotive cameras, and digital camera production. The compact design and efficient use of space make it a valuable innovation for companies looking to enhance their camera module technology.
Questions about the technology: 1. How does the placement of the MLCC below the FPCB improve space utilization in the camera module? 2. What are the key advantages of using a multi-layer ceramic condenser in this camera module design?
Frequently Updated Research: Stay updated on advancements in camera module technology, particularly in the integration of components to improve performance and space utilization. Research on MLCC technology and its applications in electronic devices can provide valuable insights into the development of camera modules.
Original Abstract Submitted
A camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (RPCB), a metal plate coupled to the lower surface of the RPCB and having one or more holes formed therein, a multi-layer ceramic condenser (MLCC) disposed in the one or more holes in the RPCB, and an image sensor disposed on the metal plate. With reference to the lower surface of the RPCB, the MLCC may be formed to have a height less than the height of the metal plate. A camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (FPCB), an RPCB coupled to the lower surface of the FPCB and having one or more first holes formed therein, a metal plate coupled to the lower surface of the RPCB and having one or more second holes formed in areas corresponding to the first holes, respectively, an MLCC disposed in the first holes and the second holes below the FPCB, and an image sensor disposed on the metal plate. The MLCC may be disposed in at least one of spaces formed through the first holes and the second holes. According to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.
