18405259. COOLING SYSTEM FOR POWER ELECTRONICS simplified abstract (Carrier Corporation)
Contents
COOLING SYSTEM FOR POWER ELECTRONICS
Organization Name
Inventor(s)
Arindom Joardar of Jamesville NY (US)
Tobias Sienel of Baldwinsville NY (US)
COOLING SYSTEM FOR POWER ELECTRONICS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18405259 titled 'COOLING SYSTEM FOR POWER ELECTRONICS
Simplified Explanation: The patent application describes a cooling system for heat-generating devices, consisting of a heat sink and a heat exchanger that transfers heat to a primary cooling fluid and a secondary cooling fluid.
- The cooling system includes a heat sink and a heat exchanger.
- The heat sink is thermally coupled to the heat-generating devices.
- The heat exchanger has a first flow path for the primary cooling fluid and a second flow path for the secondary cooling fluid.
- Heat is transferred to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.
Potential Applications: 1. Electronics cooling systems. 2. Automotive cooling systems. 3. Industrial machinery cooling systems.
Problems Solved: 1. Efficient cooling of heat-generating devices. 2. Temperature regulation in various applications.
Benefits: 1. Improved heat dissipation. 2. Enhanced performance and longevity of devices. 3. Energy efficiency.
Commercial Applications: Cooling systems for electronic devices, automotive applications, and industrial machinery.
Prior Art: Prior art related to this technology can be found in patents related to heat exchangers, cooling systems, and thermal management in various industries.
Frequently Updated Research: Research on advancements in heat exchanger technology, cooling system efficiency, and thermal management solutions is relevant to this technology.
Questions about Cooling Systems: 1. How does the cooling system impact the overall performance of heat-generating devices? 2. What are the key factors to consider when designing an efficient cooling system for different applications?
Original Abstract Submitted
A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid. Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.
