18405030. SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsuan-Ying Mai of Taoyuan City (TW)
Hui-Chun Lee of Hsinchu City (TW)
SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18405030 titled 'SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
Simplified Explanation
The method described in the abstract involves using a brush assembly with inner and outer brush members of different rigidities to clean a semiconductor wafer by rotating the brush assembly against the wafer's backside surface.
- The method involves placing a semiconductor wafer over a wafer stage.
- A brush assembly is pressed against the backside surface of the wafer, with an inner brush member and an outer brush member made of materials of different rigidities.
- The outer brush member surrounds the inner brush member laterally.
- The brush assembly is rotated relative to the semiconductor wafer.
Potential Applications
The technology could be applied in semiconductor manufacturing processes for cleaning wafers effectively and efficiently.
Problems Solved
This technology helps in removing contaminants and particles from the backside surface of semiconductor wafers, ensuring the quality and reliability of the wafers.
Benefits
The method offers a precise and controlled way of cleaning semiconductor wafers, potentially leading to improved yields and reduced defects in semiconductor devices.
Potential Commercial Applications
"Semiconductor Wafer Cleaning Method Using Brush Assembly with Varying Rigidities" could find applications in semiconductor fabrication facilities, equipment manufacturers, and companies involved in wafer processing.
Possible Prior Art
There may be prior art related to methods for cleaning semiconductor wafers using brush assemblies, but specific information on similar technologies is not provided in the abstract.
Unanswered Questions
How does this method compare to traditional wafer cleaning techniques in terms of efficiency and effectiveness?
The article does not provide a direct comparison between this innovative method and traditional wafer cleaning techniques. It would be beneficial to understand the advantages and limitations of this new approach in comparison to existing methods.
What are the potential challenges or limitations of implementing this technology in large-scale semiconductor manufacturing facilities?
The abstract does not address the scalability or practical considerations of using this method in industrial settings. Exploring the challenges and limitations of integrating this technology into existing semiconductor manufacturing processes would provide valuable insights for potential adopters.
Original Abstract Submitted
In accordance with some embodiments, a method includes placing a semiconductor wafer over a wafer stage; pressing a brush assembly against a backside surface of the semiconductor wafer, wherein the brush assembly comprises an inner brush member and an outer brush member laterally surrounding the inner brush member, and the outer brush member is made of a material having a lower rigidity than the inner brush member; rotating the brush assembly relative to the semiconductor wafer.
