18404516. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Isamu Nishimura of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18404516 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a first semiconductor element, a second semiconductor element, an insulating element with a first coil, a second coil magnetically coupled to the first coil, and a support substrate where the semiconductor elements are mounted. The support substrate includes an insulating base member and substrate wiring formed on the base member, with the first wiring member electrically interposed between the first semiconductor element and the first coil, and the second wiring member electrically interposed between the second semiconductor element and the second coil. The second coil is positioned between the first coil and the base member, and the insulating element is supported by the support substrate.
- The semiconductor device includes two semiconductor elements, each with its own coil and support substrate.
- The support substrate features an insulating base member and substrate wiring connecting the semiconductor elements to their respective coils.
- The second coil is magnetically coupled to the first coil and positioned between the first coil and the base member.
- The insulating element is supported by the support substrate, providing stability and insulation for the device.
- This design allows for efficient operation and integration of the semiconductor elements within the device.
Potential Applications: - Power electronics - Electric vehicles - Renewable energy systems
Problems Solved: - Efficient coupling of semiconductor elements - Improved stability and insulation - Enhanced performance in power applications
Benefits: - Increased efficiency - Enhanced reliability - Improved performance in various applications
Commercial Applications: Title: "Advanced Semiconductor Device for Power Electronics Applications" This technology can be utilized in power electronics, electric vehicles, and renewable energy systems, offering improved efficiency and performance in these sectors.
Questions about the technology: 1. How does the magnetic coupling between the coils enhance the device's performance? 2. What are the specific advantages of using this semiconductor device in electric vehicles?
Original Abstract Submitted
A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element including a first coil; a second coil magnetically coupled to the first coil; and a support substrate on which the first semiconductor element and the second semiconductor element are mounted. The support substrate includes an insulating base member, and a substrate wiring formed on the base member. The substrate wiring includes a first wiring member electrically interposed between the first semiconductor element and the first coil, and a second wiring member electrically interposed between the second semiconductor element and the second coil. The second coil is arranged between the first coil and the base member. The insulating element is supported by the support substrate.
