18403982. BIASABLE ELECTROSTATIC CHUCK simplified abstract (Applied Materials, Inc.)
Contents
BIASABLE ELECTROSTATIC CHUCK
Organization Name
Inventor(s)
Paneendra Prakash Bhat of Fremont CA (US)
Qiwei Liang of Fremont CA (US)
Douglas Buchberger of Livermore CA (US)
Dmitry Lubomirsky of Cupertino CA (US)
Naveen Kumar Nagaraja of Bangalore (IN)
Vijay D. Parkhe of San Jose CA (US)
BIASABLE ELECTROSTATIC CHUCK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18403982 titled 'BIASABLE ELECTROSTATIC CHUCK
The patent application describes substrate support assemblies with an electrostatic chuck body that includes a substrate support surface and a substrate seat, as well as a backside gas lumen and a bias electrode with conductive mesas.
- The electrostatic chuck body defines a substrate support surface with a substrate seat.
- A backside gas lumen extends through a surface of the substrate seat.
- The bias electrode is coupled with the electrostatic chuck body and includes conductive mesas that protrude upward across the substrate seat.
- A support stem is coupled with the electrostatic chuck body.
- At least one chucking electrode is embedded within the electrostatic chuck body.
- At least one heater is embedded within the electrostatic chuck body.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer bonding
Problems Solved: - Secure and stable substrate support - Efficient heat transfer - Control of electrostatic forces
Benefits: - Improved substrate handling - Enhanced process control - Increased productivity
Commercial Applications: Title: Advanced Substrate Support Assemblies for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve wafer handling and processing efficiency, leading to higher yields and lower production costs.
Questions about the technology: 1. How does the design of the bias electrode contribute to the performance of the substrate support assemblies? 2. What are the advantages of embedding heaters within the electrostatic chuck body for semiconductor manufacturing processes?
Original Abstract Submitted
Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The electrostatic chuck body may define a backside gas lumen that extends through a surface of the substrate seat. The assemblies may include a bias electrode coupled with the electrostatic chuck body. The bias electrode may include a plurality of conductive mesas that protrude upward across the substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include at least one chucking electrode embedded within the electrostatic chuck body. The assemblies may include at least one heater embedded within the electrostatic chuck body.
