18403510. MANUFACTURING METHOD OF ELECTRONIC DEVICE simplified abstract (Innolux Corporation)
Contents
- 1 MANUFACTURING METHOD OF ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MANUFACTURING METHOD OF ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about the Technology
- 1.11 Frequently Updated Research
- 1.12 Original Abstract Submitted
MANUFACTURING METHOD OF ELECTRONIC DEVICE
Organization Name
Inventor(s)
Kai Cheng of Miao-Li County (TW)
Fang-Ying Lin of Miao-Li County (TW)
Ming-Chang Lin of Miao-Li County (TW)
Tsau-Hua Hsieh of Miao-Li County (TW)
MANUFACTURING METHOD OF ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18403510 titled 'MANUFACTURING METHOD OF ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a method for manufacturing electronic devices by transferring electronic components from one substrate to another using adhesive material and a laser process.
- Adhering adhesive material to electronic components on a first substrate.
- Transferring the components to a target substrate through a laser process.
- Attaching the components to the target substrate via the adhesive material.
Key Features and Innovation
- Use of adhesive material to transfer electronic components.
- Laser process for precise transfer of components.
- Efficient method for manufacturing electronic devices.
Potential Applications
This technology can be applied in the manufacturing of various electronic devices such as smartphones, tablets, and wearable technology.
Problems Solved
This method addresses the challenge of transferring delicate electronic components from one substrate to another without damaging them.
Benefits
- Precise and efficient transfer of electronic components.
- Cost-effective manufacturing process.
- Improved quality control in electronic device production.
Commercial Applications
- Electronics manufacturing industry.
- Research and development of new electronic devices.
- Semiconductor industry.
Questions about the Technology
1. How does the adhesive material ensure the secure transfer of electronic components? 2. What are the advantages of using a laser process for transferring electronic components?
Frequently Updated Research
There may be ongoing research in the field of laser-assisted electronic component transfer for further optimization and efficiency.
Original Abstract Submitted
A manufacturing method of an electronic device includes: providing a first substrate, which has a base layer and a plurality of electronic components disposed on the base layer; adhering adhesive material to each of the plurality of electronic components; providing a target substrate, wherein the target substrate and the first substrate are separated from each other by a distance; and transferring at least part of the plurality of electronic components adhered with the adhesive material to the target substrate through a laser process, wherein at least part of the plurality of electronic components are attached to the target substrate via the adhesive material.
