18402755. APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME simplified abstract (Micron Technology, Inc.)
Contents
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Chien Wen Huang of Taichung (TW)
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18402755 titled 'APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME
Simplified Explanation:
This patent application discloses semiconductor devices with interfacing segments patterned within a protective layer to provide attachment interfaces for connection pads and warpage control.
- The semiconductor devices include one or more interfacing segments patterned within an outer protective layer.
- The interfacing segments provide attachment interfaces/surfaces for connection pads.
- The interfacing segments or a portion thereof may remain uncovered or exposed to provide warpage control for the semiconductor device.
Potential Applications: The technology can be applied in various semiconductor devices, such as integrated circuits, sensors, and memory devices.
Problems Solved: The technology addresses issues related to attachment interfaces and warpage control in semiconductor devices, improving their reliability and performance.
Benefits: The technology enhances the attachment interfaces for connection pads and provides effective warpage control, leading to improved functionality and durability of semiconductor devices.
Commercial Applications: Title: Enhanced Semiconductor Devices for Improved Reliability This technology can be utilized in the manufacturing of consumer electronics, automotive systems, and industrial equipment, enhancing the performance and longevity of semiconductor devices in these applications.
Prior Art: There is no specific information provided on prior art related to this technology in the patent application.
Frequently Updated Research: There is no information available on frequently updated research relevant to this technology in the patent application.
Questions about Semiconductor Devices with Interfacing Segments: Question 1: How does the technology of interfacing segments improve the reliability of semiconductor devices? - The technology of interfacing segments enhances the attachment interfaces for connection pads, improving the reliability of semiconductor devices by providing secure connections.
Question 2: What are the potential challenges in implementing interfacing segments in semiconductor devices? - Potential challenges in implementing interfacing segments may include precise patterning within the protective layer and ensuring compatibility with existing semiconductor manufacturing processes.
Original Abstract Submitted
Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide warpage control for the corresponding semiconductor device.
