18402416. METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP simplified abstract (Samsung Electronics Co., Ltd.)
Contents
METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP
Organization Name
Inventor(s)
Kyungwook Hwang of Suwon-si (KR)
Joonyong Park of Suwon-si (KR)
Sanghoon Song of Suwon-si (KR)
METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 18402416 titled 'METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP
The method described in the abstract involves transferring electronic chips from a base substrate to a target substrate using a relay substrate and a solvent.
- Electronic chips are first attached to a relay substrate, which is then separated from the base substrate.
- The target substrate is wetted with a solvent to facilitate the transfer of the electronic chips.
- The electronic chips attached to the relay substrate are then transferred to the target substrate.
- The relay substrate is pressed in the thickness direction of the target substrate to ensure proper adhesion.
- Finally, the target substrate is dried to complete the transfer process.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Microchip production
Problems Solved: - Efficient and precise transfer of electronic chips - Minimization of damage during transfer process - Enhanced adhesion between chips and substrate
Benefits: - Improved manufacturing processes - Higher quality electronic products - Cost-effective production methods
Commercial Applications: Title: Advanced Electronic Chip Transfer Method for Semiconductor Industry This technology can be utilized in semiconductor manufacturing plants to streamline the production process and improve the quality of electronic devices. It can also be adopted by electronics assembly companies to enhance the efficiency of chip transfer operations.
Questions about Electronic Chip Transfer Method: 1. How does this method compare to traditional chip transfer techniques? This method offers a more precise and efficient way of transferring electronic chips compared to traditional methods. It minimizes the risk of damage and ensures better adhesion between the chips and the substrate.
2. What are the key factors to consider when selecting a solvent for wetting the target substrate? The selection of a solvent for wetting the target substrate depends on factors such as compatibility with the materials involved, evaporation rate, and environmental considerations. It is important to choose a solvent that effectively wets the substrate without causing any damage.
Original Abstract Submitted
A method of transferring electronic chips includes attaching, to a relay substrate, the electronic chips arranged on a base substrate, separating the electronic chips from the base substrate, wetting a target substrate using a solvent, transferring, to the target substrate, the electronic chips that are attached to the relay substrate, pressing the relay substrate in a thickness direction of the target substrate, and drying the target substrate.
