18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
Contents
- 1 CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18401099 titled 'CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
Simplified Explanation
The abstract describes a semiconductor die assembly with conductive buffer layers between copper pads on two semiconductor dies, allowing for direct bonding between the dies.
- The semiconductor die assembly includes first and second semiconductor dies with copper pads forming an interconnect.
- The interconnect includes a conductive buffer material with aggregates of conductive particles.
- The conductive buffer material allows for electrical connection between the copper pads without them being physically joined.
- The conductive buffer material is porous, enabling compression of the conductive particles in response to pressure.
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor devices, such as microprocessors, memory chips, and sensors.
Problems Solved
This innovation solves the problem of achieving direct electrical connection between semiconductor dies without the need for traditional wire bonding or flip-chip techniques.
Benefits
The use of conductive buffer layers simplifies the assembly process, reduces manufacturing costs, and improves the reliability and performance of semiconductor devices.
Potential Commercial Applications
One potential commercial application of this technology is in the production of high-performance computing devices for applications in data centers, artificial intelligence, and autonomous vehicles.
Possible Prior Art
Prior art in this field may include similar techniques for creating electrical connections between semiconductor dies, such as using conductive adhesives or solder bumps.
Unanswered Questions
How does the conductive buffer material affect the thermal properties of the semiconductor die assembly?
The abstract does not provide information on how the conductive buffer material may impact the thermal conductivity or heat dissipation of the semiconductor die assembly.
What are the potential challenges in scaling up this technology for mass production?
The abstract does not address the potential obstacles or limitations that may arise when implementing this technology on a larger scale for commercial manufacturing.
Original Abstract Submitted
Conductive buffer layers for semiconductor die assemblies, and associated systems and methods are disclosed. In an embodiment, a semiconductor die assembly includes first and second semiconductor dies directly bonded to each other. The first semiconductor die includes a first copper pad and the second semiconductor die includes a second copper pad. The first and second copper pads form an interconnect between the first and second semiconductor dies, and the interconnect includes a conductive buffer material between the first and second copper pads, where the conductive buffer material includes aggregates of conductive particles. In some embodiments, the first and second copper pads are not conjoined but electrically connected to each other through the conductive buffer material. In some embodiments, the conductive buffer material is porous such that the aggregates of conductive particles can be compressed together in response to the pressure applied to the conductive buffer layer.
