18400994. TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract (Micron Technology, Inc.)

TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY

Organization Name

Micron Technology, Inc.

Inventor(s)

James Brian Johnson of Boise ID (US)

Brent Keeth of Boise ID (US)

Ameen D. Akel of Rancho Cordova CA (US)

Kunal R. Parekh of Boise ID (US)

Amy Rae Griffin of Boise ID (US)

Eiichi Nakano of Boise ID (US)

TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18400994 titled 'TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY

Simplified Explanation

The patent application describes methods, systems, and devices for modular die configurations for multi-channel memory. A semiconductor component is configured with multiple rows and columns of memory arrays, along with associated channels, control regions, and contact regions.

• Memory arrays are grouped into independently-operable memory dies with control and contact regions for operating the memory arrays.
• Control regions include control circuitry for operating memory arrays on one or both sides of the region.
• The semiconductor component allows for efficient operation and management of multi-channel memory configurations.

Key Features and Innovation

• Modular die configurations for multi-channel memory
• Semiconductor component with multiple rows and columns of memory arrays
• Control regions with control circuitry for efficient memory array operation
• Grouping of memory arrays into independently-operable memory dies

Potential Applications

• Data centers
• High-performance computing
• Networking equipment
• Consumer electronics

Problems Solved

• Efficient operation of multi-channel memory configurations
• Improved management of memory arrays
• Enhanced performance in memory-intensive applications

Benefits

• Increased efficiency in memory operations
• Enhanced performance in data processing
• Improved scalability and flexibility in memory configurations

Commercial Applications

The technology can be applied in various industries such as data centers, high-performance computing, networking equipment, and consumer electronics. It offers improved efficiency, performance, and scalability in memory operations, making it valuable for companies seeking to enhance their data processing capabilities.

Frequently Updated Research

Research on advancements in semiconductor technology, memory array design, and control circuitry for memory operations may provide further insights into optimizing multi-channel memory configurations.

Questions about Modular Die Configurations for Multi-Channel Memory

1. How does the semiconductor component manage multiple rows and columns of memory arrays efficiently? 2. What are the potential applications of modular die configurations for multi-channel memory in different industries?

Original Abstract Submitted

Methods, systems, and devices for modular die configurations for multi-channel memory are described. A semiconductor component (e.g., a semiconductor wafer) may be configured with multiple rows and multiple columns of memory arrays, and associated channels. A row of memory arrays may be associated with a contact region extending along the row direction. The semiconductor component may also include control regions extending along the column direction between at least some of the columns of memory arrays. Each control region may include control circuitry for operating memory arrays on one or both sides of the control region. The channels and memory arrays of the semiconductor wafer may be grouped into one or more independently-operable memory dies, with each memory die having at least a portion of a control region and at least a portion of a contact region for operating the memory arrays of the memory die.