18400401. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)

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ELECTRONIC COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Satoshi Yokomizo of Nagaokakyo-shi (JP)

Shinobu Chikuma of Nagaokakyo-shi (JP)

Yohei Mukobata of Nagaokakyo-shi (JP)

ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18400401 titled 'ELECTRONIC COMPONENT

The abstract describes an electronic component comprising an electronic element and an interposer board. The electronic element consists of a multilayer body with external electrodes connected to internal electrode layers. The interposer board, made of alumina, has board end surfaces, board side surfaces, and board main surfaces. The external electrodes include a first Sn plated layer covering the interposer board's outer surface near at least one board end surface.

  • The electronic component includes a multilayer body with external electrodes connected to internal electrode layers.
  • The interposer board, made of alumina, has board end surfaces, board side surfaces, and board main surfaces.
  • External electrodes have a first Sn plated layer covering the interposer board's outer surface near at least one board end surface.

Potential Applications: - Electronics manufacturing - Circuit board assembly - Semiconductor industry

Problems Solved: - Enhanced connectivity between electronic elements and interposer boards - Improved durability and reliability of electronic components

Benefits: - Increased efficiency in electronic device performance - Enhanced structural integrity of electronic assemblies - Cost-effective manufacturing processes

Commercial Applications: Title: "Advanced Electronic Component for Enhanced Connectivity in Circuit Boards" This technology can be utilized in the production of various electronic devices, such as smartphones, laptops, and automotive electronics, to improve connectivity and reliability.

Prior Art: Previous patents may exist related to electronic components with interposer boards, but specific details would need to be researched.

Frequently Updated Research: Ongoing studies may focus on optimizing the design and materials used in electronic components for improved performance and longevity.

Questions about Electronic Components with Interposer Boards: 1. How does the use of alumina in the interposer board impact the overall performance of the electronic component? 2. What are the potential challenges in integrating the external electrodes with the interposer board in electronic assemblies?


Original Abstract Submitted

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

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