18399871. ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR simplified abstract (Robert Bosch GmbH)
Contents
- 1 ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Electronic Control Units
- 1.13 Original Abstract Submitted
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR
Organization Name
Inventor(s)
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18399871 titled 'ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR
Simplified Explanation
The patent application describes an electronic control unit with a unique design for efficient heat dissipation.
- The electronic control unit includes a chip support with multiple chip cavities, each containing chips with support and heat dissipation surfaces.
- Support protrusions on the bottom wall of the chip cavities ensure proper contact between the chips and a heat sink for effective heat dissipation.
Key Features and Innovation
- Electronic control unit with chip cavities for efficient heat dissipation.
- Support protrusions on the bottom wall of chip cavities ensure proper contact between chips and heat sink.
Potential Applications
This technology can be used in electronic devices that require effective heat dissipation, such as electric compressors, power supplies, and control units.
Problems Solved
Ensures all chips are in good contact with the heat sink for optimal heat dissipation, preventing overheating and potential damage to electronic components.
Benefits
- Improved heat dissipation efficiency.
- Enhanced performance and longevity of electronic devices.
- Reduced risk of overheating and component failure.
Commercial Applications
- Electric compressors
- Power supplies
- Control units for various electronic devices
Prior Art
Readers can explore prior patents related to electronic control units, heat dissipation technologies, and chip support designs to understand the novelty of this invention.
Frequently Updated Research
Stay updated on advancements in heat dissipation technologies, electronic control units, and chip support designs to enhance the efficiency and performance of electronic devices.
Questions about Electronic Control Units
How does the design of the chip support in this electronic control unit improve heat dissipation?
The chip support design includes support protrusions on the bottom wall of chip cavities, ensuring proper contact between chips and the heat sink for efficient heat dissipation.
What are the potential applications of this electronic control unit technology beyond electric compressors?
This technology can be applied in various electronic devices that require effective heat dissipation, such as power supplies and control units for different applications.
Original Abstract Submitted
Provided in the present application are an electronic control unit, a manufacturing method thereof, and an electric compressor. The electronic control unit includes: a chip support, including a plurality of chip cavities, each of the chip cavities including a bottom wall; chips arranged in the chip cavities, each chip including: a support surface close to the bottom wall and a heat dissipation surface opposite the support surface, wherein the bottom wall of the chip cavity is provided with a plurality of support protrusions, and when the electronic control unit is completely assembled, the plurality of support protrusions are compressed and deform; and a heat sink, abutting and thermally contacting the heat dissipation surfaces of the plurality of chips. The device and method according to the embodiments of the present invention can ensure that a plurality of chips are all in good contact with a heat sink for heat dissipation.
