18399324. COMPOSITE COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)

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COMPOSITE COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Yoshiaki Satake of Nagaokakyo-shi (JP)

Tatsuya Funaki of Nagaokakyo-shi (JP)

Kei Arai of Nagaokakyo-shi (JP)

COMPOSITE COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18399324 titled 'COMPOSITE COMPONENT

The composite component described in the patent application consists of an Si base layer with rerouting layer and through-silicon via, as well as an electronic component layer with curved electronic components protruding in a mount direction.

  • Si base layer with first and second main surfaces
  • Rerouting layer on the first main surface
  • Through-silicon via electrically connected to the rerouting layer
  • Electronic component layer on the second main surface
  • Electronic components with curved shape protruding in mount direction
  • Mount surface corresponding to the curved shape with curved surfaces

Potential Applications: - Advanced electronic devices - Miniaturized circuitry - High-density integrated circuits

Problems Solved: - Space constraints in electronic components - Efficient routing of electrical connections - Improved component density

Benefits: - Enhanced circuit performance - Compact design - Increased functionality in limited space

Commercial Applications: Title: "Innovative Composite Components for High-Performance Electronics" This technology can be utilized in: - Consumer electronics - Medical devices - Aerospace industry

Prior Art: No specific information on prior art related to this technology is provided in the abstract.

Frequently Updated Research: There is no information on frequently updated research relevant to this technology in the abstract.

Questions about composite components: 1. How does the curved shape of the electronic components impact the overall performance of the composite component? 2. What are the potential challenges in manufacturing composite components with through-silicon vias and curved electronic components?


Original Abstract Submitted

A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

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