18399173. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Wookyung You of Suwon-si (KR)

Yeonggil Kim of Suwon-si (KR)

Sangkoo Kang of Suwon-si (KR)

Minjae Kang of Suwon-si (KR)

Koungmin Ryu of Suwon-si (KR)

Hoonseok Seo of Suwon-si (KR)

Woojin Lee of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18399173 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes a device structure with a first semiconductor substrate and an active pattern extending in a first direction. It also features a conductive through-via that is electrically connected to a front wiring layer and penetrates through the first semiconductor substrate. The first semiconductor substrate has a non-planarized lower surface with a curved peripheral region around the conductive through-via. Additionally, there is a first bonding structure with a planarized insulating layer on the second surface of the first semiconductor substrate and a planarized upper surface.

• The device structure includes a first semiconductor substrate and an active pattern.
• A conductive through-via is electrically connected to a front wiring layer.
• The first semiconductor substrate has a non-planarized lower surface with a curved peripheral region.
• A first bonding structure with a planarized insulating layer is present on the second surface of the first semiconductor substrate.
• The first bonding structure has a planarized upper surface.

Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the performance and reliability of electronic devices. - The innovation can be applied in the development of high-speed communication systems.

Problems Solved: - Addressing the need for improved connectivity in semiconductor devices. - Overcoming challenges related to substrate non-planarity. - Enhancing the overall efficiency of electronic components.

Benefits: - Improved electrical connectivity and signal transmission. - Enhanced structural integrity of semiconductor devices. - Increased performance and reliability of electronic systems.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Connectivity This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and networking equipment. It has the potential to revolutionize the semiconductor industry by improving connectivity and overall device performance.

Questions about Semiconductor Device Technology: 1. How does the non-planarized lower surface of the first semiconductor substrate impact the overall performance of the device? The non-planarized lower surface of the first semiconductor substrate can affect the alignment and connectivity of the components, potentially leading to signal interference and reduced efficiency.

2. What are the key advantages of using a conductive through-via in semiconductor devices? A conductive through-via provides a direct electrical connection between different layers of the device, improving signal transmission and reducing resistance for enhanced performance.

Original Abstract Submitted

A semiconductor device includes: a device structure including a first semiconductor substrate and having an active pattern extending in first direction, a conductive through-via electrically connected to a front wiring layer and penetrating through the first semiconductor substrate, wherein the first semiconductor substrate has a non-planarized lower surface in which a peripheral region around the conductive through-via curves downward, a first bonding structure having a planarized insulating layer disposed on the second surface of the first semiconductor substrate and having a planarized upper surface.