18399127. EMBEDDED LIQUID COOLING simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)

EMBEDDED LIQUID COOLING

Organization Name

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor(s)

Belgacem Haba of Saratoga CA (US)

Gaius Gillman Fountain, Jr. of Youngsville NC (US)

EMBEDDED LIQUID COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18399127 titled 'EMBEDDED LIQUID COOLING

The abstract describes a device package with an integrated cooling assembly between the package substrate and cover. The cooling assembly includes a semiconductor device and a cold plate attached to it, with a material layer between the cover and cold plate. The cold plate has a patterned first side with a coolant channel for efficient cooling.

• The device package includes a package substrate, package cover, and integrated cooling assembly.
• The package cover has an inlet and outlet opening for coolant flow.
• The cooling assembly consists of a semiconductor device and a cold plate.
• A material layer is present between the package cover and the cold plate.
• The cold plate has a patterned first side with a coolant channel.
• The coolant channel is in fluid communication with the inlet and outlet openings.

Potential Applications: - Electronic devices requiring efficient cooling systems. - High-performance computing systems. - Automotive electronics. - Aerospace applications. - Medical devices.

Problems Solved: - Overheating of semiconductor devices. - Ensuring optimal performance of electronic components. - Increasing the lifespan of electronic devices. - Enhancing overall system reliability. - Improving thermal management in compact electronic systems.

Benefits: - Improved cooling efficiency. - Enhanced performance of electronic devices. - Extended lifespan of semiconductor components. - Increased reliability of electronic systems. - Better thermal management in confined spaces.

Commercial Applications: Title: Advanced Cooling Solutions for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and medical devices to enhance the performance and reliability of electronic systems. The market implications include increased demand for efficient cooling solutions in high-performance electronic devices.

Questions about the technology: 1. How does the integrated cooling assembly improve the performance of electronic devices? 2. What are the potential cost savings associated with using this cooling technology in electronic systems?

Frequently Updated Research: Ongoing research focuses on optimizing the design of the cooling assembly to further improve cooling efficiency and thermal management in electronic devices. Stay updated on the latest advancements in integrated cooling solutions for electronic systems.

Original Abstract Submitted

A device package may include a package substrate, a package cover disposed on the package substrate, and an integrated cooling assembly disposed between the package substrate and the package cover. The package cover generally has an inlet opening and an outlet opening disposed there through. The integrated cooling assembly includes a semiconductor device and a cold plate attached to the semiconductor device. The device package may include a material layer between the package cover and the cold plate. The cold plate may include a patterned first side and an opposite second side. The patterned first side may include a base surface and sidewalls extending downward from the base surface, where the base surface is spaced apart from the semiconductor device to collectively define a coolant channel. Here, the coolant channel is in fluid communication with the inlet opening and the outlet opening through openings disposed through respective portions of the material layer.