18398680. SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
Organization Name
Inventor(s)
Kunihiro Komiya of Ukyo-Ku (JP)
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18398680 titled 'SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
The semiconductor device described in the patent application features a Chip Scale Package (CSP) structure with multiple electrode pads for signal input/output, solder bumps for external lead electrodes, and rewiring capabilities. The solder bumps are arranged in two rows along the periphery of the device, with electrode pads positioned inside the outermost solder bumps. Each trace of the rewiring extends from an electrode pad and can be connected to either an outermost or inner solder bump.
- Semiconductor device with CSP structure
- Multiple electrode pads for signal input/output
- Solder bumps for external lead electrodes
- Rewiring capabilities for flexible connections
- Two rows of solder bumps along the periphery
- Electrode pads positioned inside outermost solder bumps
Potential Applications: - Integrated circuits - Electronic devices - Semiconductor manufacturing
Problems Solved: - Improved signal input/output capabilities - Enhanced flexibility in circuit connections - Space-efficient design for compact devices
Benefits: - Increased functionality in semiconductor devices - Enhanced performance in signal transmission - Simplified manufacturing processes
Commercial Applications: Title: "Advanced Semiconductor Devices for Enhanced Connectivity" This technology can be utilized in various industries such as telecommunications, consumer electronics, and automotive electronics. The compact design and flexible connections make it ideal for applications requiring high-performance semiconductor devices.
Questions about Semiconductor Devices with CSP Structure: 1. How does the CSP structure benefit the overall performance of semiconductor devices? The CSP structure allows for a more compact design and efficient signal transmission in semiconductor devices, enhancing their overall performance.
2. What are the key advantages of using solder bumps for external lead electrodes in semiconductor devices? Solder bumps provide a reliable and durable connection for external lead electrodes, ensuring secure signal transmission in semiconductor devices.
Original Abstract Submitted
The semiconductor device has the CSP structure and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.
