18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
Contents
- 1 MICROELECTRONIC ASSEMBLIES
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
Arun Chandrasekhar of Chandler AZ (US)
MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18397873 titled 'MICROELECTRONIC ASSEMBLIES
Simplified Explanation
The abstract describes a microelectronic assembly with a package substrate and a die secured to the substrate using non-solder interconnects.
- Package substrate with first and second surfaces
- Die with first and second surfaces, conductive contacts, and interconnects
- First conductive contacts of the die connected to pathways in the package substrate using non-solder interconnects
Potential Applications
This technology could be applied in:
- Consumer electronics
- Automotive electronics
- Medical devices
Problems Solved
This technology helps in:
- Improving reliability of microelectronic assemblies
- Enhancing electrical connectivity
- Reducing the risk of solder-related issues
Benefits
The benefits of this technology include:
- Increased durability
- Enhanced performance
- Cost-effective manufacturing process
Potential Commercial Applications
The potential commercial applications of this technology could be seen in:
- Semiconductor industry
- Telecommunications sector
- Aerospace and defense
Possible Prior Art
One possible prior art could be the use of solder-based interconnects in microelectronic assemblies.
Unanswered Questions
How does this technology compare to traditional solder-based interconnects in terms of performance and reliability?
This article does not provide a direct comparison between non-solder interconnects and solder-based interconnects in terms of performance and reliability.
What are the specific materials used for the non-solder interconnects in this technology?
The article does not specify the exact materials used for the non-solder interconnects in this technology.
Original Abstract Submitted
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.
