18397756. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takafumi Yamada of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18397756 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a semiconductor chip with an upper electrode, a lead frame with a bonding part and a rising part, and a bonding member connecting the upper electrode to the bonding part. The upper electrode and the bonding part are joined in a specific configuration to optimize performance.
- The upper electrode has electrode lateral surfaces, including a first lateral surface.
- The bonding part has a bonding front surface and terminal lateral surfaces, including a second lateral surface.
- The rising part extends upward from the first lateral surface.
- The configuration ensures that the second lateral surface of the bonding part faces the first lateral surface of the upper electrode.
- Specific dimensional requirements are outlined to ensure proper alignment and functionality of the semiconductor device.
Potential Applications: - This technology can be applied in various semiconductor devices such as integrated circuits and microprocessors. - It can enhance the performance and reliability of electronic devices in industries such as telecommunications, automotive, and consumer electronics.
Problems Solved: - Ensures proper alignment and connection between the upper electrode and the bonding part. - Improves the overall performance and efficiency of semiconductor devices.
Benefits: - Enhanced reliability and performance of semiconductor devices. - Improved manufacturing processes for electronic components. - Increased durability and longevity of electronic devices.
Commercial Applications: Title: Enhanced Semiconductor Device Technology for Improved Performance This technology can be utilized in the production of advanced electronic devices, leading to higher quality products and increased customer satisfaction. The market implications include improved competitiveness for manufacturers and enhanced technological capabilities for end-users.
Questions about Semiconductor Device Technology: 1. How does the specific configuration of the upper electrode and bonding part improve the performance of the semiconductor device? 2. What are the potential cost savings associated with implementing this technology in semiconductor device manufacturing processes?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor device technology to ensure optimal performance and efficiency in electronic devices. Regularly check for new developments in materials, manufacturing processes, and design techniques to stay ahead in the industry.
Original Abstract Submitted
A semiconductor device includes a semiconductor chip including an upper electrode, a lead frame having a bonding part and a rising part, and a bonding member joining the upper electrode to the bonding part. The upper electrode has electrode lateral surfaces including a first lateral surface. The bonding part has a bonding front surface and terminal lateral surfaces that include a second lateral surface. The bonding part is joined to the upper electrode such that the second lateral surface faces the first lateral surface. The rising part extends upward from the first lateral surface. In a direction parallel to the electrode front surface, a first shortest distance between a center of the electrode front surface in a plan view and the second lateral surface is equal to or greater than 40% of a second shortest distance between the first lateral surface and the second lateral surface.
