18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)

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EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

Organization Name

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor(s)

Belgacem Haba of Saratoga CA (US)

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18397505 titled 'EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

The abstract describes a device package with an integrated cooling assembly between the package substrate and cover, including a semiconductor device and a cold plate attached to it. The cold plate has a patterned first side with a coolant channel for efficient cooling.

  • The device package includes a package substrate, package cover, and integrated cooling assembly.
  • The package cover has an inlet and outlet opening for coolant flow.
  • The cooling assembly consists of a semiconductor device and a cold plate.
  • A material layer is present between the package cover and the cold plate.
  • The cold plate has a patterned first side with a coolant channel defined by a base surface and sidewalls.
  • The coolant channel is in fluid communication with the inlet and outlet openings.

Potential Applications: - Electronic devices requiring efficient cooling systems. - High-performance computing systems. - Automotive electronics. - Aerospace applications.

Problems Solved: - Overheating of semiconductor devices. - Improving overall device performance. - Enhancing reliability and longevity of electronic components.

Benefits: - Improved thermal management. - Increased efficiency and performance. - Extended lifespan of electronic devices. - Enhanced reliability under high thermal loads.

Commercial Applications: Title: Advanced Cooling Systems for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and data centers to improve the thermal management of electronic devices, leading to enhanced performance and reliability.

Questions about the technology: 1. How does the integrated cooling assembly improve the performance of electronic devices? 2. What are the potential cost implications of implementing this cooling technology in different industries?


Original Abstract Submitted

A device package may include a package substrate, a package cover disposed on the package substrate, and an integrated cooling assembly disposed between the package substrate and the package cover. The package cover generally has an inlet opening and an outlet opening disposed there through. The integrated cooling assembly includes a semiconductor device and a cold plate attached to the semiconductor device. The device package may include a material layer between the package cover and the cold plate. The cold plate may include a patterned first side and an opposite second side. The patterned first side may include a base surface and sidewalls extending downward from the base surface, where the base surface is spaced apart from the semiconductor device to collectively define a coolant channel. Here, the coolant channel is in fluid communication with the inlet opening and the outlet opening through openings disposed through respective portions of the material layer.

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