18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Electronic Device Manufacturing
- 1.13 Original Abstract Submitted
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Organization Name
Inventor(s)
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18397354 titled 'SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a method of manufacturing an electronic device using radiant heating to solder solder balls onto bonding pads on a substrate.
- Radiant heating cover is placed over solder balls on bonding pads.
- Substrate is loaded into a vapor generating chamber with a heat transfer fluid.
- Heat transfer fluid is heated to form vapor phase in the chamber.
- Heat from vapor phase is used to solder the solder balls.
Key Features and Innovation
- Use of radiant heating cover for soldering process.
- Vapor generating chamber with heat transfer fluid.
- Efficient and precise soldering method for electronic devices.
Potential Applications
This technology can be applied in the manufacturing of various electronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology solves the problem of precise and efficient soldering of solder balls onto bonding pads on electronic devices.
Benefits
- Improved soldering process.
- Enhanced reliability of electronic devices.
- Cost-effective manufacturing method.
Commercial Applications
- Electronic device manufacturing industry.
- Semiconductor industry.
- Consumer electronics market.
Prior Art
Readers can explore prior art related to radiant heating in soldering processes in the field of electronic device manufacturing.
Frequently Updated Research
Stay updated on advancements in radiant heating technology for soldering processes in electronic device manufacturing.
Questions about Electronic Device Manufacturing
How does radiant heating improve the soldering process in electronic device manufacturing?
Radiant heating provides a precise and efficient way to solder solder balls onto bonding pads on electronic devices, ensuring a reliable connection.
What are the potential applications of this technology beyond electronic device manufacturing?
This technology can potentially be applied in other industries that require precise soldering processes, such as the automotive or aerospace industries.
Original Abstract Submitted
In a method of manufacturing an electronic device, a substrate having a plurality of bonding pads formed on a first surface of the substrate is provided. Solder balls are attached on the bonding pads respectively. At least one radiant heating cover is disposed on the first surface of the substrate to cover the solder balls. The substrate on which the at least one radiant heating cover is disposed is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to form the heat transfer fluid in a vapor phase within the chamber. The solder balls are soldered by transferring heat generated when the heat transfer fluid in the vapor phase is brought to contact a surface of the radiant heating cover and condenses toward the solder balls as radiant heat emitted from the radiant heating cover.
