18396827. LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
Organization Name
Inventor(s)
YUMI Komamiya of Kanagawa (JP)
SHINGO Okushima of Kanagawa (JP)
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18396827 titled 'LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
The liquid ejecting head described in the patent application includes a substrate with ejection openings for liquid, a flow-path member supporting the substrate, and a heating unit to heat the ejection region.
- The substrate has ejection openings for liquid ejection.
- The flow-path member has a supply flow path and a collection flow path for liquid.
- The heating unit heats the ejection region of the substrate.
Potential Applications: - Printing technology - Industrial coating processes - Biomedical applications
Problems Solved: - Efficient liquid ejection - Controlled heating of the ejection region - Precise liquid collection
Benefits: - Improved printing quality - Enhanced coating uniformity - Increased productivity in liquid handling processes
Commercial Applications: Title: Advanced Liquid Ejecting Head for Precision Applications This technology can be used in high-speed printing systems, automated coating machines, and medical devices requiring precise liquid dispensing.
Questions about the technology: 1. How does the heating unit impact the liquid ejection process?
The heating unit ensures that the liquid ejected is at the desired temperature for optimal performance.
2. What are the advantages of having separate supply and collection flow paths?
The separate paths allow for better control and management of the liquid flow, leading to more accurate dispensing.
Original Abstract Submitted
A liquid ejecting head includes: a substrate including ejection openings configured to eject liquid; a flow-path member supporting the substrate and having a supply flow path that supplies the substrate with liquid, on one side in a first direction intersecting the arrangement direction of the ejection openings and a collection flow path that collects liquid from the substrate, on the other side; and a heating unit that heats an ejection region including the liquid ejection openings in the substrate. On both sides of the ejection region of the substrate in the first direction, the collection flow path is located on a side where the distance between the ejection region and a side of the substrate in the first direction is longer and the supply flow path is located on a side where the distance between the ejection region and a side of the substrate in the first direction is shorter.
