18396813. SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
Organization Name
Inventor(s)
Jongyoon Choi of Suwon-si (KR)
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18396813 titled 'SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
The semiconductor device described in the abstract consists of a stack structure on a substrate with gate electrodes and insulating layers stacked alternately. It also includes a first through via and a second through via, with the second through via being electrically connected to the farthest gate electrode from the substrate in the vertical direction.
- The semiconductor device features a unique through via configuration with two vias spaced apart and electrically connected to different gate electrodes.
- The first through via includes vertical patterns and protrusions that overlap specific gate electrodes in the horizontal direction.
- The second through via is connected to the gate electrode farthest from the substrate, providing a specific electrical pathway within the device.
Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices for various electronic applications. - It can enhance the performance and efficiency of integrated circuits in electronic devices.
Problems Solved: - Provides a more efficient and optimized electrical connection within the semiconductor device. - Improves the overall functionality and reliability of the device.
Benefits: - Enhanced electrical connectivity and performance. - Increased efficiency and reliability of semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Device with Unique Through Via Configuration This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics. It can also benefit industries that require advanced semiconductor technology for their products.
Questions about the technology: 1. How does the unique through via configuration improve the performance of the semiconductor device? - The unique through via configuration enhances electrical connectivity and efficiency within the device, leading to improved overall performance.
2. What are the potential commercial applications of this advanced semiconductor device? - The technology can be applied in various electronic devices and industries that require high-performance semiconductor components for their products.
Original Abstract Submitted
A semiconductor device comprising: a stack structure on a substrate including gate electrodes and insulating layers alternately stacked; a first through via extending through the stack structure; and a second through via spaced apart from the first through via, wherein the second through via extends through the stack structure, wherein the second through via is electrically connected to a first gate electrode that is farthest one among the gate electrodes from the substrate in the vertical direction, wherein a gate pad is on and contacts the first gate electrode, and the first through via includes: a vertical pattern; first and second protrusions that protrude from the vertical pattern, wherein the first protrusion overlaps a portion of the first gate electrode in the horizontal direction; and the second protrusion overlaps a second gate electrode in the horizontal direction, wherein the second gate electrode is spaced apart from the second through via.
