18396553. ELECTROSTATIC CHUCK simplified abstract (Samsung Electronics Co., Ltd.)
Contents
ELECTROSTATIC CHUCK
Organization Name
Inventor(s)
Younseon Wang of SUWON-SI (KR)
ELECTROSTATIC CHUCK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18396553 titled 'ELECTROSTATIC CHUCK
The abstract describes an electrostatic chuck with a unique design to prevent reaction gas permeation.
- Electrostatic chuck body with a step portion and an adhesive layer.
- Ceramic puck adhered to the adhesive layer with an edge protruding.
- Sealant between the step portion and the edge of the ceramic puck.
- Sealant includes a coating layer with a metal oxide, rare earth oxide, and/or multilayer heterogeneous metal oxide.
Potential Applications: - Semiconductor manufacturing - Flat panel display production - Nanotechnology research
Problems Solved: - Preventing reaction gas permeation - Ensuring secure adhesion of ceramic puck
Benefits: - Improved chuck performance - Enhanced reliability in manufacturing processes
Commercial Applications: Title: Advanced Electrostatic Chuck for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve wafer handling and processing efficiency.
Prior Art: Research on ceramic puck adhesion methods in semiconductor manufacturing equipment.
Frequently Updated Research: Ongoing studies on materials science for chuck design optimization.
Questions about Electrostatic Chuck Technology: 1. How does the sealant prevent reaction gas permeation? The sealant creates a barrier between the step portion and the ceramic puck's edge, blocking the gas from entering the adhesive layer.
2. What are the advantages of using a ceramic puck in an electrostatic chuck? Ceramic pucks offer high thermal stability and excellent electrical insulation properties, making them ideal for semiconductor processing applications.
Original Abstract Submitted
An electrostatic chuck includes an electrostatic chuck body having a step portion protruding from a lower end, an adhesive layer disposed on an upper surface of the electrostatic chuck body, a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body, and a sealant disposed between the step portion and the edge of the ceramic puck and configured to block reaction gas from permeating into the adhesive layer. The sealant includes a coating layer disposed on an external surface thereof, and the coating layer includes a metal oxide including a single rare earth oxide and/or a multilayer heterogeneous metal oxide.
