18394829. AXIALLY ARRANGED COMMUNICATION AND THERMAL INTERCONNECTS FOR FOLDABLE ELECTRONIC DEVICES simplified abstract (Intel Corporation)

AXIALLY ARRANGED COMMUNICATION AND THERMAL INTERCONNECTS FOR FOLDABLE ELECTRONIC DEVICES

Organization Name

Intel Corporation

Inventor(s)

Samarth Alva of Bangalore (IN)

Prakash Kurma Raju of Bangalore (IN)

Shivaraju Neerati of Bhupalpalle (IN)

Navneet Singh of Bangalore (IN)

Ravishankar Srikanth of Bengaluru (IN)

AXIALLY ARRANGED COMMUNICATION AND THERMAL INTERCONNECTS FOR FOLDABLE ELECTRONIC DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18394829 titled 'AXIALLY ARRANGED COMMUNICATION AND THERMAL INTERCONNECTS FOR FOLDABLE ELECTRONIC DEVICES

Simplified Explanation

The abstract describes an electronic device or component with communication and thermal interconnects, hingedly coupled portions, and axially arranged interconnects with respect to a hinge axis.

• The electronic device or component may include communication and thermal interconnects.
• The device has hingedly coupled portions.
• The interconnects are axially arranged with respect to a hinge axis.

Potential Applications

This technology could be applied in:

• Foldable smartphones
• Laptops with flexible displays
• Wearable technology with folding capabilities

Problems Solved

This technology solves:

• Potential damage to communication and thermal interconnects in foldable devices
• Improved durability and flexibility in electronic devices
• Enhanced portability and usability of foldable gadgets

Benefits

The benefits of this technology include:

• Increased longevity of electronic devices
• Enhanced user experience with foldable gadgets
• Greater design flexibility for manufacturers

Potential Commercial Applications

The potential commercial applications of this technology include:

• Consumer electronics industry
• Telecommunications sector
• Wearable technology market

Possible Prior Art

One possible prior art for this technology could be:

• Foldable smartphones with hinged designs from leading tech companies

How does this technology impact the overall cost of electronic devices?

This article does not address the potential cost implications of implementing this technology in electronic devices. The cost of materials, manufacturing processes, and market pricing could all be factors affected by this innovation.

What are the environmental implications of using foldable electronic devices with this technology?

The article does not discuss the environmental impact of producing and disposing of foldable electronic devices with hinged designs. The use of materials, energy consumption, and electronic waste management could all be relevant considerations in assessing the sustainability of this technology.

Original Abstract Submitted

An electronic device or a component thereof is described, which may include communication and/or thermal interconnects. The device may include hingedly coupled portions, where the interconnects are axially arranged (e.g., coincident) with respect to a hinge axis of the foldable electronic device.