18394575. HEAT DISSIPATION STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
HEAT DISSIPATION STRUCTURES
Organization Name
Inventor(s)
Youngjoon Koh of Suwon-si (KR)
HEAT DISSIPATION STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18394575 titled 'HEAT DISSIPATION STRUCTURES
The semiconductor package described in the abstract includes a package substrate, a semiconductor device mounted on the package substrate, and a heat dissipation structure attached onto the semiconductor device. This heat dissipation structure consists of multiple vapor chambers at different levels in the vertical direction and several heat pipes extending between these vapor chambers.
- The semiconductor package features a heat dissipation structure with multiple vapor chambers and heat pipes for efficient cooling.
- The vapor chambers are positioned at various levels vertically to enhance heat dissipation capabilities.
- Heat pipes connect the vapor chambers to facilitate the transfer of heat away from the semiconductor device.
- This innovative design helps in maintaining optimal operating temperatures for the semiconductor device, improving overall performance and reliability.
- By utilizing vapor chambers and heat pipes, the semiconductor package offers advanced thermal management solutions for high-power applications.
Potential Applications: - High-performance computing systems - Data centers - Automotive electronics - Industrial machinery - Aerospace technology
Problems Solved: - Overheating issues in semiconductor devices - Thermal management challenges in high-power applications
Benefits: - Improved heat dissipation efficiency - Enhanced performance and reliability of semiconductor devices - Extended lifespan of electronic components - Better thermal management for demanding applications
Commercial Applications: Title: Advanced Thermal Management Solutions for High-Power Electronics This technology can be applied in various industries such as data centers, automotive electronics, and industrial machinery where efficient heat dissipation is crucial for optimal performance and reliability. The market implications include increased demand for high-power electronic devices with advanced thermal management capabilities.
Questions about Semiconductor Package with Vapor Chambers and Heat Pipes: 1. How do vapor chambers contribute to the heat dissipation process in the semiconductor package? 2. What are the advantages of using heat pipes in conjunction with vapor chambers for thermal management in electronic devices?
Frequently Updated Research: Ongoing research focuses on optimizing the design and materials used in vapor chambers and heat pipes to further enhance heat dissipation efficiency in semiconductor packages. Studies also explore the integration of advanced cooling technologies to address the evolving thermal management needs of high-power electronic devices.
Original Abstract Submitted
Provided is a semiconductor package including a package substrate, a semiconductor device mounted on the package substrate, and a heat dissipation structure attached onto the semiconductor device, wherein the heat dissipation structure includes a plurality of vapor chambers at different levels in the vertical direction and a plurality of heat pipes extending between the plurality of vapor chambers.
