18394168. OPTICAL MODULE simplified abstract (Sumitomo Electric Industries, Ltd.)

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OPTICAL MODULE

Organization Name

Sumitomo Electric Industries, Ltd.

Inventor(s)

Hiroshi Uemura of Osaka (JP)

OPTICAL MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18394168 titled 'OPTICAL MODULE

The optical module described in the patent application consists of a glass board with a via, an electrical element, a heat conduction member, an optical element, a temperature control element, electrical wiring, and a housing.

  • The glass board has a first face and a second face, with an electrical element mounted on the first face.
  • A heat conduction member is mounted on the second face and thermally connected to the electrical element through the via.
  • An optical element is mounted on the first face to convert between electrical and optical signals.
  • A temperature control element is mounted on the second face to adjust the temperature of the optical element.
  • Electrical wiring connects the electrical element to the optical element, forming a transmission line for the electrical signal.
  • A first housing is connected to the first face to hermetically seal the electrical and optical elements.

Potential Applications: - Optical communication systems - Data transmission devices - Fiber optic networks

Problems Solved: - Efficient heat dissipation for optical components - Integration of electrical and optical elements in a compact module

Benefits: - Improved performance and reliability of optical modules - Enhanced thermal management for sensitive optical components

Commercial Applications: Title: Advanced Optical Modules for High-Speed Data Transmission This technology can be utilized in telecommunications, data centers, and networking equipment to enhance data transmission speeds and reliability.

Questions about the technology: 1. How does the temperature control element help in maintaining the optimal temperature for the optical element? 2. What are the advantages of using a glass board with a via in this optical module design?


Original Abstract Submitted

An optical module according to one embodiment includes: a glass board having a first face, a second face, and a via. The optical module includes: an electrical element mounted on the first face; a heat conduction member mounted on the second face and thermally connected to an electrical element through the via, and an optical element mounted on the first face and converting between the electrical signal and the optical signal. The optical module includes: a temperature control element mounted on the second face and thermally connected to the optical element through the via and for adjusting the temperature of the optical element; electrical wiring electrically connecting the electrical element to the optical element and constituting a transmission line for transmitting the electrical signal; and a first housing connected to the first face and hermetically sealing the electrical element and the optical element.