18393855. LIGHT-EMITTING DIODE PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
LIGHT-EMITTING DIODE PACKAGE
Organization Name
Inventor(s)
SEUNGGYUN Jung of Suwon-si (KR)
Youngkyung Kim of Suwon-si (KR)
LIGHT-EMITTING DIODE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18393855 titled 'LIGHT-EMITTING DIODE PACKAGE
The abstract describes a patent application for a light-emitting diode package that includes various components such as a substrate, a light-emitting diode chip, a phosphor, a light conversion structure, and a transparent element.
- The light-emitting diode chip is mounted on the substrate.
- The phosphor surrounds a side surface and an upper surface of the light-emitting diode chip.
- A light conversion structure is disposed on the phosphor.
- A transparent element is placed between the phosphor and the light conversion structure.
Potential Applications: - This technology could be used in various lighting applications such as LED bulbs, displays, and automotive lighting. - It could also find applications in medical devices, horticultural lighting, and industrial lighting.
Problems Solved: - The technology addresses the need for improved light output and color rendering in LED lighting systems. - It also solves the issue of heat dissipation and light conversion efficiency in LED packages.
Benefits: - Enhanced light output and color quality. - Improved energy efficiency and longevity of LED lighting systems. - Better thermal management and overall performance of LED packages.
Commercial Applications: Title: Advanced LED Packaging Technology for Enhanced Lighting Solutions This technology could be utilized by LED manufacturers to create high-performance lighting products for residential, commercial, and industrial use. The market implications include increased demand for energy-efficient lighting solutions and improved lighting quality in various sectors.
Prior Art: Readers can explore prior art related to LED packaging technologies, phosphor materials, and light conversion structures in the field of LED lighting.
Frequently Updated Research: Stay updated on the latest advancements in LED packaging technology, phosphor development, and light conversion structures to enhance the performance and efficiency of LED lighting systems.
Questions about LED Packaging Technology: 1. How does this LED packaging technology improve light output and color rendering compared to traditional LED packages? 2. What are the key factors influencing the efficiency and performance of the light conversion structure in this technology?
Original Abstract Submitted
A light-emitting diode package includes a substrate, a light-emitting diode chip mounted on the substrate, a phosphor surrounding a side surface and an upper surface of the light-emitting diode chip, a light conversion structure disposed on the phosphor, and a transparent element disposed between the phosphor and the light conversion structure.
