18393850. SUBSTRATE SUPPORT APPARATUS simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE SUPPORT APPARATUS
Organization Name
Inventor(s)
SUBSTRATE SUPPORT APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18393850 titled 'SUBSTRATE SUPPORT APPARATUS
Simplified Explanation:
The patent application describes a substrate support apparatus with two chucks, one supporting the substrate from the bottom and the other moving it horizontally by contacting the side surface.
- The first chuck supports the substrate from the bottom surface.
- The second chuck moves the substrate horizontally by contacting the side surface.
- The second chuck is connected to the first chuck.
- It has protruding pins on the top surface, with alignment pins on each pin.
- The protruding pins are at the same horizontal distance from the center of the first chuck.
Key Features and Innovation:
- Dual chuck system for substrate support and movement.
- Protruding pins with alignment pins for precise positioning.
- Horizontal movement capability for the substrate.
Potential Applications:
The technology can be used in semiconductor manufacturing, electronics assembly, and other industries requiring precise substrate handling.
Problems Solved:
The apparatus solves the problem of accurately supporting and moving substrates during manufacturing processes.
Benefits:
- Improved accuracy in substrate handling.
- Enhanced efficiency in manufacturing processes.
- Reduced risk of substrate damage.
Commercial Applications:
The technology can be applied in industries such as semiconductor manufacturing, electronics production, and research laboratories for precise substrate handling.
Questions about Substrate Support Apparatus:
1. How does the dual chuck system improve substrate handling? 2. What are the potential benefits of using alignment pins in the chuck system?
Original Abstract Submitted
A substrate support apparatus includes a first chuck configured to support a substrate by contacting a bottom surface of the substrate, a second chuck configured to horizontally move the substrate by contacting a side surface of the substrate, wherein the second chuck includes a second chuck body coupled to the first chuck, a plurality of protruding pins vertically protruding from an outer portion of a top surface of the second chuck body, and an alignment pin vertically protruding from a top surface of each of the plurality of protruding pins, wherein the plurality of protruding pins are located at a same horizontal distance from a center of the first chuck.
