18393232. SUBSTRATE POLISHING APPARATUS simplified abstract (EBARA CORPORATION)
Contents
- 1 SUBSTRATE POLISHING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE POLISHING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Optical Surface Monitoring Systems
- 1.13 Original Abstract Submitted
SUBSTRATE POLISHING APPARATUS
Organization Name
Inventor(s)
SUBSTRATE POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18393232 titled 'SUBSTRATE POLISHING APPARATUS
Simplified Explanation
The patent application describes a system for monitoring the operation of a switching device in an optical surface monitoring system of a substrate polishing apparatus.
- The system includes a polishing table, a substrate holding head, a light source, optical heads, optical lines, an optical filter, a spectroscope, and a control device.
- The switching device has multiple channels and is connected to the optical components.
- The control device receives measurement data from the spectroscope to monitor the switching device's operation.
Key Features and Innovation
- Monitoring system for a switching device in an optical surface monitoring system.
- Integration of optical components such as optical heads, lines, filter, and spectroscope.
- Control device for receiving and analyzing measurement data.
Potential Applications
- Semiconductor manufacturing
- Optoelectronics industry
- Precision optical systems
Problems Solved
- Ensures efficient operation of the switching device.
- Allows for real-time monitoring of the device's performance.
- Enhances the overall functionality of the substrate polishing apparatus.
Benefits
- Improved process control
- Enhanced system reliability
- Increased productivity and efficiency
Commercial Applications
Optical monitoring systems for semiconductor fabrication processes.
Prior Art
Prior research may include studies on optical monitoring systems in industrial applications.
Frequently Updated Research
Ongoing research on optical monitoring technologies in manufacturing processes.
Questions about Optical Surface Monitoring Systems
What are the key components of an optical surface monitoring system?
An optical surface monitoring system typically includes optical heads, light sources, optical lines, filters, and spectrometers to analyze surface characteristics.
How does real-time monitoring benefit substrate polishing processes?
Real-time monitoring allows for immediate adjustments to optimize polishing parameters, leading to improved substrate quality and process efficiency.
Original Abstract Submitted
To relatively easily allow monitoring of the operation of a switching device even when the switching device is employed in an optical surface monitoring system of a substrate polishing apparatus. A substrate polishing apparatus includes a polishing table, a substrate holding head, a light source, a first optical head, a switching device, a first optical line, a second optical line, a third optical line, a first optical filter, a spectroscope, and a control device. The substrate holding head is configured to hold a substrate. The first optical head is configured to project light from the light source toward the substrate held by the substrate holding head and receive light reflected from the substrate, the first optical head being disposed inside the polishing table. The switching device includes a plurality of channels. The first optical line optically connects the light source to the first optical head. The second optical line optically connects the first optical head to one channel of the plurality of channels of the switching device. The third optical line optically connects the middle of the first optical line to the middle of the second optical line. The first optical filter is disposed in the third optical line. The spectroscope is optically connected to a downstream side of the switching device. The control device is configured to receive measurement data of the intensity of a wavelength dispersed by the spectroscope. The control device is configured to monitor the operation of the switching device based on the measurement data.
