18393226. SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Kwonjoong Kim of Suwon-si (KR)
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18393226 titled 'SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
The semiconductor light emitting device described in the patent application consists of a substrate, a light emitting device on the substrate, first and second pads on the upper surface, and a bonding wire connecting the light emitting device to the substrate.
- The bonding wire includes multiple portions connected to the pads at different angles, ensuring a secure connection between the light emitting device and the substrate.
- A seal covers one side surface of the light emitting device, protecting the bonding wire and enhancing the device's durability.
Potential Applications:
- This technology can be used in various lighting applications, such as LED displays, automotive lighting, and general illumination.
- It can also be applied in communication devices, medical equipment, and industrial machinery where reliable and efficient light emitting devices are required.
Problems Solved:
- Ensures a secure and reliable connection between the light emitting device and the substrate.
- Protects the bonding wire from external elements, increasing the device's lifespan and performance.
Benefits:
- Enhanced durability and reliability of the semiconductor light emitting device.
- Improved performance and efficiency in various applications.
- Cost-effective manufacturing process due to the secure bonding wire connection.
Commercial Applications:
- The technology can be utilized in the production of LED products for consumer electronics, automotive industry, and general lighting applications.
- It can also find applications in the development of advanced communication devices and medical equipment.
Questions about the technology: 1. How does the unique bonding wire design improve the performance of the semiconductor light emitting device? 2. What are the potential cost savings associated with using this technology in various applications?
Original Abstract Submitted
A semiconductor light emitting device includes: a substrate; a light emitting device provided on an upper surface of the substrate; a first pad provided on the upper surface of the substrate; a second pad provided on the upper surface of the light emitting device; a bonding wire connecting the light emitting device to the substrate, the bonding wire including: a first portion connected to and extending in a vertical direction from the first pad; a second portion extending from the first portion and inclined at a first angle relative to the first portion; a third portion extending from the second portion and inclined at a second angle is in a range of from about 125 degrees to about 150 degrees relative to the second portion; and a fourth portion extending from the third portion, inclined at a third angle relative to the third portion, and connected to the second pad; and a seal covering at least one side surface of the light emitting device and sealing the bonding wire on the substrate.
